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Effects of Varied Cleaning Methods on Ni-5% W Substrate for Dip-Coating of Water-based Buffer Layers: An X-ray Photoelectron Spectroscopy Study

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ABSTRACT

This work describes various combinations of cleaning methods involved in the preparation of Ni-5% W substrates for the deposition of buffer layers using water-based solvents. The substrate has been studied for its surface properties using X-ray photoelectron spectroscopy (XPS). The contaminants in the substrates have been quantified and the appropriate cleaning method was chosen in terms of contaminants level and showing good surface crystallinity to further consider them for depositing chemical solution-based buffer layers for Y1Ba2Cu3Oy (YBCO) coated conductors.

No MeSH data available.


XPS depth profile studies of Ni-5% W substrate after thermal cleaning followed by chemical cleaning with etching for 15 min.
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nanomaterials-02-00251-f010: XPS depth profile studies of Ni-5% W substrate after thermal cleaning followed by chemical cleaning with etching for 15 min.

Mentions: To ensure good wettability of the surface the above said sequence of thermal treatment was followed by chemical cleaning and etching. This process resulted in an improvement in the wettability with a contact angle of <5°, but the contamination with NiO did not improve as seen in Figure 10 and Figure 11.


Effects of Varied Cleaning Methods on Ni-5% W Substrate for Dip-Coating of Water-based Buffer Layers: An X-ray Photoelectron Spectroscopy Study
XPS depth profile studies of Ni-5% W substrate after thermal cleaning followed by chemical cleaning with etching for 15 min.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC5304587&req=5

nanomaterials-02-00251-f010: XPS depth profile studies of Ni-5% W substrate after thermal cleaning followed by chemical cleaning with etching for 15 min.
Mentions: To ensure good wettability of the surface the above said sequence of thermal treatment was followed by chemical cleaning and etching. This process resulted in an improvement in the wettability with a contact angle of <5°, but the contamination with NiO did not improve as seen in Figure 10 and Figure 11.

View Article: PubMed Central - PubMed

ABSTRACT

This work describes various combinations of cleaning methods involved in the preparation of Ni-5% W substrates for the deposition of buffer layers using water-based solvents. The substrate has been studied for its surface properties using X-ray photoelectron spectroscopy (XPS). The contaminants in the substrates have been quantified and the appropriate cleaning method was chosen in terms of contaminants level and showing good surface crystallinity to further consider them for depositing chemical solution-based buffer layers for Y1Ba2Cu3Oy (YBCO) coated conductors.

No MeSH data available.