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Effects of Varied Cleaning Methods on Ni-5% W Substrate for Dip-Coating of Water-based Buffer Layers: An X-ray Photoelectron Spectroscopy Study

View Article: PubMed Central - PubMed

ABSTRACT

This work describes various combinations of cleaning methods involved in the preparation of Ni-5% W substrates for the deposition of buffer layers using water-based solvents. The substrate has been studied for its surface properties using X-ray photoelectron spectroscopy (XPS). The contaminants in the substrates have been quantified and the appropriate cleaning method was chosen in terms of contaminants level and showing good surface crystallinity to further consider them for depositing chemical solution-based buffer layers for Y1Ba2Cu3Oy (YBCO) coated conductors.

No MeSH data available.


Water droplet on top of a thermally cleaned Ni-5% W substrate.
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nanomaterials-02-00251-f009: Water droplet on top of a thermally cleaned Ni-5% W substrate.

Mentions: Figure 8 shows that the top-surface is revealing the Ni peak. The broad hump around 855 eV which was observed in Figure 5 and allocated to oxidized nickel is now absent. The wettability of the substrate was slightly improved as seen in Figure 9 (contact angle of <55°).


Effects of Varied Cleaning Methods on Ni-5% W Substrate for Dip-Coating of Water-based Buffer Layers: An X-ray Photoelectron Spectroscopy Study
Water droplet on top of a thermally cleaned Ni-5% W substrate.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC5304587&req=5

nanomaterials-02-00251-f009: Water droplet on top of a thermally cleaned Ni-5% W substrate.
Mentions: Figure 8 shows that the top-surface is revealing the Ni peak. The broad hump around 855 eV which was observed in Figure 5 and allocated to oxidized nickel is now absent. The wettability of the substrate was slightly improved as seen in Figure 9 (contact angle of <55°).

View Article: PubMed Central - PubMed

ABSTRACT

This work describes various combinations of cleaning methods involved in the preparation of Ni-5% W substrates for the deposition of buffer layers using water-based solvents. The substrate has been studied for its surface properties using X-ray photoelectron spectroscopy (XPS). The contaminants in the substrates have been quantified and the appropriate cleaning method was chosen in terms of contaminants level and showing good surface crystallinity to further consider them for depositing chemical solution-based buffer layers for Y1Ba2Cu3Oy (YBCO) coated conductors.

No MeSH data available.