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Effects of Varied Cleaning Methods on Ni-5% W Substrate for Dip-Coating of Water-based Buffer Layers: An X-ray Photoelectron Spectroscopy Study

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ABSTRACT

This work describes various combinations of cleaning methods involved in the preparation of Ni-5% W substrates for the deposition of buffer layers using water-based solvents. The substrate has been studied for its surface properties using X-ray photoelectron spectroscopy (XPS). The contaminants in the substrates have been quantified and the appropriate cleaning method was chosen in terms of contaminants level and showing good surface crystallinity to further consider them for depositing chemical solution-based buffer layers for Y1Ba2Cu3Oy (YBCO) coated conductors.

No MeSH data available.


Perfectly wetted droplet of water on top of the substrate chemically cleaned with etching for 15 min.
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nanomaterials-02-00251-f006: Perfectly wetted droplet of water on top of the substrate chemically cleaned with etching for 15 min.

Mentions: However, chemical cleaning followed by etching for 15 min significantly improved the wettability of the substrate with a contact angle of <2° (Figure 6). This improvement in the wettability can be interpreted as an increased adhesion of water on the surface of the substrate which could have been caused by an increase in roughness of the substrate due to the formation of NiO (Figure 6).


Effects of Varied Cleaning Methods on Ni-5% W Substrate for Dip-Coating of Water-based Buffer Layers: An X-ray Photoelectron Spectroscopy Study
Perfectly wetted droplet of water on top of the substrate chemically cleaned with etching for 15 min.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC5304587&req=5

nanomaterials-02-00251-f006: Perfectly wetted droplet of water on top of the substrate chemically cleaned with etching for 15 min.
Mentions: However, chemical cleaning followed by etching for 15 min significantly improved the wettability of the substrate with a contact angle of <2° (Figure 6). This improvement in the wettability can be interpreted as an increased adhesion of water on the surface of the substrate which could have been caused by an increase in roughness of the substrate due to the formation of NiO (Figure 6).

View Article: PubMed Central - PubMed

ABSTRACT

This work describes various combinations of cleaning methods involved in the preparation of Ni-5% W substrates for the deposition of buffer layers using water-based solvents. The substrate has been studied for its surface properties using X-ray photoelectron spectroscopy (XPS). The contaminants in the substrates have been quantified and the appropriate cleaning method was chosen in terms of contaminants level and showing good surface crystallinity to further consider them for depositing chemical solution-based buffer layers for Y1Ba2Cu3Oy (YBCO) coated conductors.

No MeSH data available.