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Copper-Containing Anti-Biofilm Nanofiber Scaffolds as a Wound Dressing Material.

Ahire JJ, Hattingh M, Neveling DP, Dicks LM - PLoS ONE (2016)

Bottom Line: Nanofibers containing copper particles (Cu-F) were thinner (326 ± 149 nm in diameter), compared to nanofibers without copper (CF; 445 ± 93 nm in diameter).The copper particles had no effect on the thermal degradation and thermal behaviour of Cu-F, as shown by thermogravimetric analysis (TGA) and differential scanning calorimeter (DSC).After 48 h in the presence of Cu-F, biofilm formation by P. aeruginosa PA01 and S. aureus Xen 30 was reduced by 41% and 50%, respectively.

View Article: PubMed Central - PubMed

Affiliation: Department of Microbiology, University of Stellenbosch, 7602 Matieland (Stellenbosch), South Africa.

ABSTRACT
Copper particles were incorporated into nanofibers during the electrospinning of poly-D,L-lactide (PDLLA) and poly(ethylene oxide) (PEO). The ability of the nanofibers to prevent Pseudomonas aeruginosa PA01 and Staphylococcus aureus (strain Xen 30) to form biofilms was tested. Nanofibers containing copper particles (Cu-F) were thinner (326 ± 149 nm in diameter), compared to nanofibers without copper (CF; 445 ± 93 nm in diameter). The crystalline structure of the copper particles in Cu-F was confirmed by X-ray diffraction (XRD). Copper crystals were encapsulated, but also attached to the surface of Cu-F, as shown scanning transmission electron microscopy (STEM) and transmission electron microscopy (TEM), respectively. The copper particles had no effect on the thermal degradation and thermal behaviour of Cu-F, as shown by thermogravimetric analysis (TGA) and differential scanning calorimeter (DSC). After 48 h in the presence of Cu-F, biofilm formation by P. aeruginosa PA01 and S. aureus Xen 30 was reduced by 41% and 50%, respectively. Reduction in biofilm formation was ascribed to copper released from the nanofibers. Copper-containing nanofibers may be incorporated into wound dressings.

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(a) Thermal behaviour of control nanofibers (CF), copper-containing nanofibers (Cu-F) and copper particles (Cu). (b) Differential scanning calorimetric (DSC) thermograms of CF, Cu-F and Cu.
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pone.0152755.g004: (a) Thermal behaviour of control nanofibers (CF), copper-containing nanofibers (Cu-F) and copper particles (Cu). (b) Differential scanning calorimetric (DSC) thermograms of CF, Cu-F and Cu.

Mentions: With TGA analyses (Fig 4A), two distinct weight losses were observed for CF and may be attributed to the PDLLA (50 wt. %) and PEO (50 wt. %) homo-polymers, respectively [31]. The addition of copper particles had no major effect on the thermal degradation of the nanofibers. Similar to the CF, two weight losses were visible until 40% of the original weight remained. This implies that the sample had a copper content of 40 wt. %, as neat copper was stable throughout the entire temperature range. No thermal events were observed in DSC for neat copper within the operating temperature range. The melting endotherms and crystallization exotherms recorded for Cu-F were similar to those observed for CF, indicating that the copper particles had no effect on the thermal behaviour of the samples (Fig 4B).


Copper-Containing Anti-Biofilm Nanofiber Scaffolds as a Wound Dressing Material.

Ahire JJ, Hattingh M, Neveling DP, Dicks LM - PLoS ONE (2016)

(a) Thermal behaviour of control nanofibers (CF), copper-containing nanofibers (Cu-F) and copper particles (Cu). (b) Differential scanning calorimetric (DSC) thermograms of CF, Cu-F and Cu.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC4814046&req=5

pone.0152755.g004: (a) Thermal behaviour of control nanofibers (CF), copper-containing nanofibers (Cu-F) and copper particles (Cu). (b) Differential scanning calorimetric (DSC) thermograms of CF, Cu-F and Cu.
Mentions: With TGA analyses (Fig 4A), two distinct weight losses were observed for CF and may be attributed to the PDLLA (50 wt. %) and PEO (50 wt. %) homo-polymers, respectively [31]. The addition of copper particles had no major effect on the thermal degradation of the nanofibers. Similar to the CF, two weight losses were visible until 40% of the original weight remained. This implies that the sample had a copper content of 40 wt. %, as neat copper was stable throughout the entire temperature range. No thermal events were observed in DSC for neat copper within the operating temperature range. The melting endotherms and crystallization exotherms recorded for Cu-F were similar to those observed for CF, indicating that the copper particles had no effect on the thermal behaviour of the samples (Fig 4B).

Bottom Line: Nanofibers containing copper particles (Cu-F) were thinner (326 ± 149 nm in diameter), compared to nanofibers without copper (CF; 445 ± 93 nm in diameter).The copper particles had no effect on the thermal degradation and thermal behaviour of Cu-F, as shown by thermogravimetric analysis (TGA) and differential scanning calorimeter (DSC).After 48 h in the presence of Cu-F, biofilm formation by P. aeruginosa PA01 and S. aureus Xen 30 was reduced by 41% and 50%, respectively.

View Article: PubMed Central - PubMed

Affiliation: Department of Microbiology, University of Stellenbosch, 7602 Matieland (Stellenbosch), South Africa.

ABSTRACT
Copper particles were incorporated into nanofibers during the electrospinning of poly-D,L-lactide (PDLLA) and poly(ethylene oxide) (PEO). The ability of the nanofibers to prevent Pseudomonas aeruginosa PA01 and Staphylococcus aureus (strain Xen 30) to form biofilms was tested. Nanofibers containing copper particles (Cu-F) were thinner (326 ± 149 nm in diameter), compared to nanofibers without copper (CF; 445 ± 93 nm in diameter). The crystalline structure of the copper particles in Cu-F was confirmed by X-ray diffraction (XRD). Copper crystals were encapsulated, but also attached to the surface of Cu-F, as shown scanning transmission electron microscopy (STEM) and transmission electron microscopy (TEM), respectively. The copper particles had no effect on the thermal degradation and thermal behaviour of Cu-F, as shown by thermogravimetric analysis (TGA) and differential scanning calorimeter (DSC). After 48 h in the presence of Cu-F, biofilm formation by P. aeruginosa PA01 and S. aureus Xen 30 was reduced by 41% and 50%, respectively. Reduction in biofilm formation was ascribed to copper released from the nanofibers. Copper-containing nanofibers may be incorporated into wound dressings.

Show MeSH
Related in: MedlinePlus