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Design of exceptionally strong and conductive Cu alloys beyond the conventional speculation via the interfacial energy-controlled dispersion of γ-Al2O3 nanoparticles.

Han SZ, Kim KH, Kang J, Joh H, Kim SM, Ahn JH, Lee J, Lim SH, Han B - Sci Rep (2015)

Bottom Line: In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled.We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes.Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu.

View Article: PubMed Central - PubMed

Affiliation: Structural Materials Division, Korea Institute of Materials Science, Changwon, 51508, Korea.

ABSTRACT
The development of Cu-based alloys with high-mechanical properties (strength, ductility) and electrical conductivity plays a key role over a wide range of industrial applications. Successful design of the materials, however, has been rare due to the improvement of mutually exclusive properties as conventionally speculated. In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled. We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes. It is shown that the Ti dramatically drives the interfacial phase transformation from very irregular to homogeneous spherical morphologies resulting in substantial enhancement of the mechanical property of Cu matrix. Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu. We validate experimental results using TEM and EDX combined with first-principles density functional theory (DFT) calculations, which all consistently poise that our materials are suitable for industrial applications.

No MeSH data available.


Related in: MedlinePlus

TEM images of dispersed alumina nanoparticles at Cu-8Al in (a) and in (b) at Cu-4Al-4Ti alloys after internal oxidations. The insets represent the particle structures predicted by Wulff construction method based on ab-initio calculated interface energies.
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f8: TEM images of dispersed alumina nanoparticles at Cu-8Al in (a) and in (b) at Cu-4Al-4Ti alloys after internal oxidations. The insets represent the particle structures predicted by Wulff construction method based on ab-initio calculated interface energies.

Mentions: Using the DFT calculated interfacial energies, we predicted the morphologies of dispersed γ–Al2O3 nanoparticles with and without added Ti using the Wulff construction method30. Figure 8 shows both the images observed by TEM and the DFT calculations (insets). Our first-principles DFT calculations support the underlying mechanism for the high mechanical strength, ductility and electrical conductivity of Cu alloys.


Design of exceptionally strong and conductive Cu alloys beyond the conventional speculation via the interfacial energy-controlled dispersion of γ-Al2O3 nanoparticles.

Han SZ, Kim KH, Kang J, Joh H, Kim SM, Ahn JH, Lee J, Lim SH, Han B - Sci Rep (2015)

TEM images of dispersed alumina nanoparticles at Cu-8Al in (a) and in (b) at Cu-4Al-4Ti alloys after internal oxidations. The insets represent the particle structures predicted by Wulff construction method based on ab-initio calculated interface energies.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC4663622&req=5

f8: TEM images of dispersed alumina nanoparticles at Cu-8Al in (a) and in (b) at Cu-4Al-4Ti alloys after internal oxidations. The insets represent the particle structures predicted by Wulff construction method based on ab-initio calculated interface energies.
Mentions: Using the DFT calculated interfacial energies, we predicted the morphologies of dispersed γ–Al2O3 nanoparticles with and without added Ti using the Wulff construction method30. Figure 8 shows both the images observed by TEM and the DFT calculations (insets). Our first-principles DFT calculations support the underlying mechanism for the high mechanical strength, ductility and electrical conductivity of Cu alloys.

Bottom Line: In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled.We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes.Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu.

View Article: PubMed Central - PubMed

Affiliation: Structural Materials Division, Korea Institute of Materials Science, Changwon, 51508, Korea.

ABSTRACT
The development of Cu-based alloys with high-mechanical properties (strength, ductility) and electrical conductivity plays a key role over a wide range of industrial applications. Successful design of the materials, however, has been rare due to the improvement of mutually exclusive properties as conventionally speculated. In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled. We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes. It is shown that the Ti dramatically drives the interfacial phase transformation from very irregular to homogeneous spherical morphologies resulting in substantial enhancement of the mechanical property of Cu matrix. Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu. We validate experimental results using TEM and EDX combined with first-principles density functional theory (DFT) calculations, which all consistently poise that our materials are suitable for industrial applications.

No MeSH data available.


Related in: MedlinePlus