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Design of exceptionally strong and conductive Cu alloys beyond the conventional speculation via the interfacial energy-controlled dispersion of γ-Al2O3 nanoparticles.

Han SZ, Kim KH, Kang J, Joh H, Kim SM, Ahn JH, Lee J, Lim SH, Han B - Sci Rep (2015)

Bottom Line: In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled.We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes.Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu.

View Article: PubMed Central - PubMed

Affiliation: Structural Materials Division, Korea Institute of Materials Science, Changwon, 51508, Korea.

ABSTRACT
The development of Cu-based alloys with high-mechanical properties (strength, ductility) and electrical conductivity plays a key role over a wide range of industrial applications. Successful design of the materials, however, has been rare due to the improvement of mutually exclusive properties as conventionally speculated. In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled. We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes. It is shown that the Ti dramatically drives the interfacial phase transformation from very irregular to homogeneous spherical morphologies resulting in substantial enhancement of the mechanical property of Cu matrix. Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu. We validate experimental results using TEM and EDX combined with first-principles density functional theory (DFT) calculations, which all consistently poise that our materials are suitable for industrial applications.

No MeSH data available.


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TEM images of the microstructures for Cu-based alloys of Cu-0.8%Al in (a) and in (b) Cu-0.7%Al-0.1%Ti, for (c) Cu-0.4%Al-0.4%Ti and in (d) Cu-0.6%Al-0.4%Ti. All materials were oxidized for 2 hours at 980 °C in 1 atmosphere. Distribution of the dispersed oxide nanoparticles in each alloy was plot as a function of size at (e–h), respectively.
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f3: TEM images of the microstructures for Cu-based alloys of Cu-0.8%Al in (a) and in (b) Cu-0.7%Al-0.1%Ti, for (c) Cu-0.4%Al-0.4%Ti and in (d) Cu-0.6%Al-0.4%Ti. All materials were oxidized for 2 hours at 980 °C in 1 atmosphere. Distribution of the dispersed oxide nanoparticles in each alloy was plot as a function of size at (e–h), respectively.

Mentions: Figure 3 presents the TEM observations of the Al2O3 nanoparticles dispersed over the four Cu alloys after two hours of internal oxidations at 980 °C and 1 atm. These images show that the morphologies and spatial distribution of the dispersed Al2O3 are sensitive to Ti composition. Increasing the relative weight fraction of Ti to Al decreases the oxide particle size and increases the total number of particles.


Design of exceptionally strong and conductive Cu alloys beyond the conventional speculation via the interfacial energy-controlled dispersion of γ-Al2O3 nanoparticles.

Han SZ, Kim KH, Kang J, Joh H, Kim SM, Ahn JH, Lee J, Lim SH, Han B - Sci Rep (2015)

TEM images of the microstructures for Cu-based alloys of Cu-0.8%Al in (a) and in (b) Cu-0.7%Al-0.1%Ti, for (c) Cu-0.4%Al-0.4%Ti and in (d) Cu-0.6%Al-0.4%Ti. All materials were oxidized for 2 hours at 980 °C in 1 atmosphere. Distribution of the dispersed oxide nanoparticles in each alloy was plot as a function of size at (e–h), respectively.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC4663622&req=5

f3: TEM images of the microstructures for Cu-based alloys of Cu-0.8%Al in (a) and in (b) Cu-0.7%Al-0.1%Ti, for (c) Cu-0.4%Al-0.4%Ti and in (d) Cu-0.6%Al-0.4%Ti. All materials were oxidized for 2 hours at 980 °C in 1 atmosphere. Distribution of the dispersed oxide nanoparticles in each alloy was plot as a function of size at (e–h), respectively.
Mentions: Figure 3 presents the TEM observations of the Al2O3 nanoparticles dispersed over the four Cu alloys after two hours of internal oxidations at 980 °C and 1 atm. These images show that the morphologies and spatial distribution of the dispersed Al2O3 are sensitive to Ti composition. Increasing the relative weight fraction of Ti to Al decreases the oxide particle size and increases the total number of particles.

Bottom Line: In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled.We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes.Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu.

View Article: PubMed Central - PubMed

Affiliation: Structural Materials Division, Korea Institute of Materials Science, Changwon, 51508, Korea.

ABSTRACT
The development of Cu-based alloys with high-mechanical properties (strength, ductility) and electrical conductivity plays a key role over a wide range of industrial applications. Successful design of the materials, however, has been rare due to the improvement of mutually exclusive properties as conventionally speculated. In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled. We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes. It is shown that the Ti dramatically drives the interfacial phase transformation from very irregular to homogeneous spherical morphologies resulting in substantial enhancement of the mechanical property of Cu matrix. Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu. We validate experimental results using TEM and EDX combined with first-principles density functional theory (DFT) calculations, which all consistently poise that our materials are suitable for industrial applications.

No MeSH data available.


Related in: MedlinePlus