Limits...
Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips.

Lima RS, Leão PA, Piazzetta MH, Monteiro AM, Shiroma LY, Gobbi AL, Carrilho E - Sci Rep (2015)

Bottom Line: This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests.Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature.Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives.

View Article: PubMed Central - PubMed

Affiliation: Laboratório de Microfabricação, Laboratório Nacional de Nanotecnologia, Centro Nacional de Pesquisa em Energia e Materiais, Campinas, São Paulo 13083-970, Brazil.

ABSTRACT
A new protocol for fabrication of glass microchips is addressed in this research paper. Initially, the method involves the use of an uncured SU-8 intermediate to seal two glass slides irreversibly as in conventional adhesive bonding-based approaches. Subsequently, an additional step removes the adhesive layer from the channels. This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests. Named sacrificial adhesive layer (SAB), the protocol meets the requirements of an ideal microfabrication technique such as throughput, relatively low cost, feasibility for ultra large-scale integration (ULSI), and high adhesion strength, supporting pressures on the order of 5 MPa. Furthermore, SAB eliminates the use of high temperature, pressure, or potential, enabling the deposition of thin films for electrical or electrochemical experiments. Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature. Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives.

No MeSH data available.


Related in: MedlinePlus

Microchannels, ATZs, and SU-8 surface morphology.Photo of the substrate incorporating channel and ATZs (a), profilometry image of microchannel and ATZs (b), photo by digital microscope showing the Al film-coated cavities (c), and AFM image of the SU-8 surface (d). m, microchannel; ATZ, air-trapping zone, and r, reservoir.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
getmorefigures.php?uid=PMC4543966&req=5

f3: Microchannels, ATZs, and SU-8 surface morphology.Photo of the substrate incorporating channel and ATZs (a), profilometry image of microchannel and ATZs (b), photo by digital microscope showing the Al film-coated cavities (c), and AFM image of the SU-8 surface (d). m, microchannel; ATZ, air-trapping zone, and r, reservoir.

Mentions: Cavities around the microchannel called air-trapping zones (ATZs) were engraved on substrate at the same time as the etching of the microchannels These structures are illustrated in Fig. 3. That being so, the etching mask covered both the regions for microchannel and ATZ. The latter aims to retain the air bubbles created during the preliminary bonding in the interface of glass slides28. Thus, ATZs improve adhesion strength and bonding quality (measured by reducing the defect rate).


Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips.

Lima RS, Leão PA, Piazzetta MH, Monteiro AM, Shiroma LY, Gobbi AL, Carrilho E - Sci Rep (2015)

Microchannels, ATZs, and SU-8 surface morphology.Photo of the substrate incorporating channel and ATZs (a), profilometry image of microchannel and ATZs (b), photo by digital microscope showing the Al film-coated cavities (c), and AFM image of the SU-8 surface (d). m, microchannel; ATZ, air-trapping zone, and r, reservoir.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC4543966&req=5

f3: Microchannels, ATZs, and SU-8 surface morphology.Photo of the substrate incorporating channel and ATZs (a), profilometry image of microchannel and ATZs (b), photo by digital microscope showing the Al film-coated cavities (c), and AFM image of the SU-8 surface (d). m, microchannel; ATZ, air-trapping zone, and r, reservoir.
Mentions: Cavities around the microchannel called air-trapping zones (ATZs) were engraved on substrate at the same time as the etching of the microchannels These structures are illustrated in Fig. 3. That being so, the etching mask covered both the regions for microchannel and ATZ. The latter aims to retain the air bubbles created during the preliminary bonding in the interface of glass slides28. Thus, ATZs improve adhesion strength and bonding quality (measured by reducing the defect rate).

Bottom Line: This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests.Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature.Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives.

View Article: PubMed Central - PubMed

Affiliation: Laboratório de Microfabricação, Laboratório Nacional de Nanotecnologia, Centro Nacional de Pesquisa em Energia e Materiais, Campinas, São Paulo 13083-970, Brazil.

ABSTRACT
A new protocol for fabrication of glass microchips is addressed in this research paper. Initially, the method involves the use of an uncured SU-8 intermediate to seal two glass slides irreversibly as in conventional adhesive bonding-based approaches. Subsequently, an additional step removes the adhesive layer from the channels. This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests. Named sacrificial adhesive layer (SAB), the protocol meets the requirements of an ideal microfabrication technique such as throughput, relatively low cost, feasibility for ultra large-scale integration (ULSI), and high adhesion strength, supporting pressures on the order of 5 MPa. Furthermore, SAB eliminates the use of high temperature, pressure, or potential, enabling the deposition of thin films for electrical or electrochemical experiments. Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature. Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives.

No MeSH data available.


Related in: MedlinePlus