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Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus

MD snapshots of cross-sectional view of groove profile after the 3rd scratching pass in multi-passes nanoscratching of single crystalline Cu samples.Crystallographic orientations of (a) (010), (b) (110) and (c) (111). Atoms are colored according to their atomic heights.
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pone.0131886.g009: MD snapshots of cross-sectional view of groove profile after the 3rd scratching pass in multi-passes nanoscratching of single crystalline Cu samples.Crystallographic orientations of (a) (010), (b) (110) and (c) (111). Atoms are colored according to their atomic heights.

Mentions: Be consistent with the experiments, MD simulations of multi-pass nanoscratching on Cu(110) along [110] direction and Cu(111) along [112] direction are also carried out. Fig 9(A), 9(B) and 9(C) present MD snapshots of cross-sectional view of groove profiles for the Cu(010), Cu(110) and Cu(111) after the 3rd scratching pass, respectively. It is found from Fig 9 that both the groove depth and the volume of surface pile up for the Cu(010) and Cu(110) are significantly larger than that for the Cu(111) [36]. Furthermore, while surface pile up is mainly accumulated on the left side of the groove for the Cu(010) and Cu(110), the material pile up symmetrically resides on the both sides of the groove for the Cu(111). Above theoretical observations are qualitatively consistent with the experimental results.


Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

MD snapshots of cross-sectional view of groove profile after the 3rd scratching pass in multi-passes nanoscratching of single crystalline Cu samples.Crystallographic orientations of (a) (010), (b) (110) and (c) (111). Atoms are colored according to their atomic heights.
© Copyright Policy
Related In: Results  -  Collection

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Show All Figures
getmorefigures.php?uid=PMC4492598&req=5

pone.0131886.g009: MD snapshots of cross-sectional view of groove profile after the 3rd scratching pass in multi-passes nanoscratching of single crystalline Cu samples.Crystallographic orientations of (a) (010), (b) (110) and (c) (111). Atoms are colored according to their atomic heights.
Mentions: Be consistent with the experiments, MD simulations of multi-pass nanoscratching on Cu(110) along [110] direction and Cu(111) along [112] direction are also carried out. Fig 9(A), 9(B) and 9(C) present MD snapshots of cross-sectional view of groove profiles for the Cu(010), Cu(110) and Cu(111) after the 3rd scratching pass, respectively. It is found from Fig 9 that both the groove depth and the volume of surface pile up for the Cu(010) and Cu(110) are significantly larger than that for the Cu(111) [36]. Furthermore, while surface pile up is mainly accumulated on the left side of the groove for the Cu(010) and Cu(110), the material pile up symmetrically resides on the both sides of the groove for the Cu(111). Above theoretical observations are qualitatively consistent with the experimental results.

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus