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Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus

Normal load-dependent groove depth in multi-passes nanoscratching experiments of single crystalline Cu samples.Crystallographic orientations of (a) (010), (b) (110) and (c) (111).
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pone.0131886.g008: Normal load-dependent groove depth in multi-passes nanoscratching experiments of single crystalline Cu samples.Crystallographic orientations of (a) (010), (b) (110) and (c) (111).

Mentions: Fig 8(A), 8(B) and 8(C) plot the depths of multi-passes scratching-induced grooves formed on the Cu(010), Cu(110) and Cu(111) under six different loads, respectively. In each scratching pass, measurements of the groove profile at three random positions are performed. The error bars shown in Fig 8 demonstrate good reproducibility of the scratching experimental data. It is found from Fig 8 that for each scratching pass, the groove depth is the largest for the Cu(110), followed by the Cu(100), and the Cu(111). Furthermore, Fig 8 demonstrates that the crystallographic orientation dependence of groove depth is not influenced by the applied normal load, as the linear fitting lines for different loads mainly parallel to each other.


Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

Normal load-dependent groove depth in multi-passes nanoscratching experiments of single crystalline Cu samples.Crystallographic orientations of (a) (010), (b) (110) and (c) (111).
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC4492598&req=5

pone.0131886.g008: Normal load-dependent groove depth in multi-passes nanoscratching experiments of single crystalline Cu samples.Crystallographic orientations of (a) (010), (b) (110) and (c) (111).
Mentions: Fig 8(A), 8(B) and 8(C) plot the depths of multi-passes scratching-induced grooves formed on the Cu(010), Cu(110) and Cu(111) under six different loads, respectively. In each scratching pass, measurements of the groove profile at three random positions are performed. The error bars shown in Fig 8 demonstrate good reproducibility of the scratching experimental data. It is found from Fig 8 that for each scratching pass, the groove depth is the largest for the Cu(110), followed by the Cu(100), and the Cu(111). Furthermore, Fig 8 demonstrates that the crystallographic orientation dependence of groove depth is not influenced by the applied normal load, as the linear fitting lines for different loads mainly parallel to each other.

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus