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Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus

Machined surface morphologies of Cu samples after the 3rd scratching pass.AFM images of the machined surface of (a) (010), (b) (110) and (c) (111) orientations; (d) presents groove profiles of Cu samples with different orientations.
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pone.0131886.g007: Machined surface morphologies of Cu samples after the 3rd scratching pass.AFM images of the machined surface of (a) (010), (b) (110) and (c) (111) orientations; (d) presents groove profiles of Cu samples with different orientations.

Mentions: With the insights into the nanoscratching mechanisms of single crystalline Cu(010) obtained in the Section 3.1, the influence of crystallographic orientation on the nanoscratching is further examined by performing experiments and MD simulations of nanoscratching on Cu(110) along [110] direction and Cu(111) along [112] direction. The parameters used in the nanoscratching experiments are the same for each sample. Fig 7(A), 7(B) and 7(C) present AFM images characterizing the machined surface morphologies for Cu(010), Cu(110) and Cu(111) after the third scratching pass under a normal load of 37.2 μN, respectively. Furthermore, Fig 7(D) plots the profiles of scratching-induced grooves for the three Cu samples. For each sample, three random sampling positions shown in the corresponding AFM image are selected to obtain the cross-sectional profile of the groove, and the plotted groove height in Fig 7(D) is obtained by averaging the three heights accordingly. It is found from Fig 7 that for each crystallographic orientation, the multi-passes nanoscratching yields nearly uniform groove depths and surface pile-up heights at different positions along the groove. However, the machined surface quality is strongly dependent on the crystallographic orientation. Fig 7 shows that both groove depth and height of surface pile-up are the largest for the Cu(110), followed by the Cu(100), and the Cu(111). Furthermore, while the surface pile-up of Cu(010) and Cu(110) mainly resides on the left side of the groove, the surface pile up of Cu(111) is symmetrically distributed along the groove. In particular, there are continuous chips formed at the end of the groove for the Cu(111), which is consistent with previous experimental results [35].


Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

Machined surface morphologies of Cu samples after the 3rd scratching pass.AFM images of the machined surface of (a) (010), (b) (110) and (c) (111) orientations; (d) presents groove profiles of Cu samples with different orientations.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC4492598&req=5

pone.0131886.g007: Machined surface morphologies of Cu samples after the 3rd scratching pass.AFM images of the machined surface of (a) (010), (b) (110) and (c) (111) orientations; (d) presents groove profiles of Cu samples with different orientations.
Mentions: With the insights into the nanoscratching mechanisms of single crystalline Cu(010) obtained in the Section 3.1, the influence of crystallographic orientation on the nanoscratching is further examined by performing experiments and MD simulations of nanoscratching on Cu(110) along [110] direction and Cu(111) along [112] direction. The parameters used in the nanoscratching experiments are the same for each sample. Fig 7(A), 7(B) and 7(C) present AFM images characterizing the machined surface morphologies for Cu(010), Cu(110) and Cu(111) after the third scratching pass under a normal load of 37.2 μN, respectively. Furthermore, Fig 7(D) plots the profiles of scratching-induced grooves for the three Cu samples. For each sample, three random sampling positions shown in the corresponding AFM image are selected to obtain the cross-sectional profile of the groove, and the plotted groove height in Fig 7(D) is obtained by averaging the three heights accordingly. It is found from Fig 7 that for each crystallographic orientation, the multi-passes nanoscratching yields nearly uniform groove depths and surface pile-up heights at different positions along the groove. However, the machined surface quality is strongly dependent on the crystallographic orientation. Fig 7 shows that both groove depth and height of surface pile-up are the largest for the Cu(110), followed by the Cu(100), and the Cu(111). Furthermore, while the surface pile-up of Cu(010) and Cu(110) mainly resides on the left side of the groove, the surface pile up of Cu(111) is symmetrically distributed along the groove. In particular, there are continuous chips formed at the end of the groove for the Cu(111), which is consistent with previous experimental results [35].

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus