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Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus

Inclination of the probe.Probe configuration (a) before nanoscratching and (b) after the 3rd scratching pass. Atoms in (b) are colored according to their displacement magnitudes.
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pone.0131886.g006: Inclination of the probe.Probe configuration (a) before nanoscratching and (b) after the 3rd scratching pass. Atoms in (b) are colored according to their displacement magnitudes.

Mentions: It is also seen from Fig 3 that during the multi-passes nanoscratching the triangular pyramid-shaped probe is inclined, as compared to its original geometry. And the inclination angle increases with scratching pass number. To characterize the inclination of the probe, the initial configuration of the probe shown in Fig 6(A) is chosen as the reference to obtain the displacement magnitude of the probe after the nanoscratching. Fig 6(B) presents the atomic configuration of the probe colored by atomic displacement magnitudes after the third scratching pass, indicating that the inclination of the probe is composed of lateral displacement and radial rotation. And the atomic displacement magnitude of the probe increases with atomic height. The inclination of probe during the load-controlled multi-passes nanoscratching can be attributed to the heterogeneous deformation occurred within the material. It’s should be noted that in the experiments, the slight rotation and oscillation of the probe are eliminated after each scratching pass because of the large normal spring constant of the cantilever.


Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

Inclination of the probe.Probe configuration (a) before nanoscratching and (b) after the 3rd scratching pass. Atoms in (b) are colored according to their displacement magnitudes.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC4492598&req=5

pone.0131886.g006: Inclination of the probe.Probe configuration (a) before nanoscratching and (b) after the 3rd scratching pass. Atoms in (b) are colored according to their displacement magnitudes.
Mentions: It is also seen from Fig 3 that during the multi-passes nanoscratching the triangular pyramid-shaped probe is inclined, as compared to its original geometry. And the inclination angle increases with scratching pass number. To characterize the inclination of the probe, the initial configuration of the probe shown in Fig 6(A) is chosen as the reference to obtain the displacement magnitude of the probe after the nanoscratching. Fig 6(B) presents the atomic configuration of the probe colored by atomic displacement magnitudes after the third scratching pass, indicating that the inclination of the probe is composed of lateral displacement and radial rotation. And the atomic displacement magnitude of the probe increases with atomic height. The inclination of probe during the load-controlled multi-passes nanoscratching can be attributed to the heterogeneous deformation occurred within the material. It’s should be noted that in the experiments, the slight rotation and oscillation of the probe are eliminated after each scratching pass because of the large normal spring constant of the cantilever.

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus