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Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus

Machined surface morphologies of single crystal Cu(010) after multi-passes nanoscratching.AFM image of the machined surface after (a) 1st, (b) 2nd and (c) 3rd scratching passes. The scratching direction is highlighted by the arrow. (d) Profiles of multi-passes scratching-induced grooves.
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pone.0131886.g002: Machined surface morphologies of single crystal Cu(010) after multi-passes nanoscratching.AFM image of the machined surface after (a) 1st, (b) 2nd and (c) 3rd scratching passes. The scratching direction is highlighted by the arrow. (d) Profiles of multi-passes scratching-induced grooves.

Mentions: Fig 2(A)–2(C) present AFM images of machined surface morphologies of single crystalline Cu(010) after the 1st, 2nd and 3rd scratching passes under a normal load of 37.2 μN, respectively. For each scratching pass, the scratching direction is the same as [100]. Fig 2(D) further quantitatively characterizes the profiles of multi-passes nanoscratching-induced grooves. It is found from Fig 2 that for each scratching pass, there is V-shaped groove formed on the sample surface, and the accumulation of surface pile-up mainly resides on the left side of the groove. Fig 2(D) demonstrates that for each scratching pass, either height or volume of the surface pile-up is larger than that of the groove, indicating that the material removal is primarily achieved through accumulation of surface pile-up, rather than formation of chips [33–34]. Fig 2(D) also suggests that the influence of scratching pass on the groove profile is not trivial. With the increase of scratching pass number, both the height of surface pile up and the depth of groove increase.


Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Geng Y, Zhang J, Yan Y, Yu B, Geng L, Sun T - PLoS ONE (2015)

Machined surface morphologies of single crystal Cu(010) after multi-passes nanoscratching.AFM image of the machined surface after (a) 1st, (b) 2nd and (c) 3rd scratching passes. The scratching direction is highlighted by the arrow. (d) Profiles of multi-passes scratching-induced grooves.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC4492598&req=5

pone.0131886.g002: Machined surface morphologies of single crystal Cu(010) after multi-passes nanoscratching.AFM image of the machined surface after (a) 1st, (b) 2nd and (c) 3rd scratching passes. The scratching direction is highlighted by the arrow. (d) Profiles of multi-passes scratching-induced grooves.
Mentions: Fig 2(A)–2(C) present AFM images of machined surface morphologies of single crystalline Cu(010) after the 1st, 2nd and 3rd scratching passes under a normal load of 37.2 μN, respectively. For each scratching pass, the scratching direction is the same as [100]. Fig 2(D) further quantitatively characterizes the profiles of multi-passes nanoscratching-induced grooves. It is found from Fig 2 that for each scratching pass, there is V-shaped groove formed on the sample surface, and the accumulation of surface pile-up mainly resides on the left side of the groove. Fig 2(D) demonstrates that for each scratching pass, either height or volume of the surface pile-up is larger than that of the groove, indicating that the material removal is primarily achieved through accumulation of surface pile-up, rather than formation of chips [33–34]. Fig 2(D) also suggests that the influence of scratching pass on the groove profile is not trivial. With the increase of scratching pass number, both the height of surface pile up and the depth of groove increase.

Bottom Line: The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed.Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined.Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

View Article: PubMed Central - PubMed

Affiliation: The State Key Laboratory of Robotics and Systems, Robotics Institute, Harbin Institute of Technology, Harbin, Heilongjiang, 150008, P. R. China; Center for Precision Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, 150001, P. R. China.

ABSTRACT
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.

No MeSH data available.


Related in: MedlinePlus