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Comparative endothelial cell response on topographically patterned titanium and silicon substrates with micrometer to sub-micrometer feature sizes.

Vandrangi P, Gott SC, Kozaka R, Rodgers VG, Rao MP - PLoS ONE (2014)

Bottom Line: These specific materials are chosen due to their relevance for implantable microdevice applications, while grating-based patterns are chosen for the potential they afford for inducing elongated and aligned cellular morphologies reminiscent of the native endothelium.Moreover, we show similar trending on patterned Si substrates, albeit to a lesser extent than on comparably patterned Ti substrates.Collectively, these results suggest promise for sub-micrometer topographic patterning in general, and sub-micrometer patterning of Ti specifically, as a means for enhancing endothelialization and neovascularisation for novel implantable microdevice applications.

View Article: PubMed Central - PubMed

Affiliation: Department of Mechanical Engineering, University of California Riverside, Riverside, California, United States of America; Department of Bioengineering, University of California Riverside, Riverside, California, United States of America.

ABSTRACT
In this work, we evaluate the in vitro response of endothelial cells (EC) to variation in precisely-defined, micrometer to sub-micrometer scale topography on two different substrate materials, titanium (Ti) and silicon (Si). Both substrates possess identically-patterned surfaces composed of microfabricated, groove-based gratings with groove widths ranging from 0.5 to 50 µm, grating pitch twice the groove width, and groove depth of 1.3 µm. These specific materials are chosen due to their relevance for implantable microdevice applications, while grating-based patterns are chosen for the potential they afford for inducing elongated and aligned cellular morphologies reminiscent of the native endothelium. Using EA926 cells, a human EC variant, we show significant improvement in cellular adhesion, proliferation, morphology, and function with decreasing feature size on patterned Ti substrates. Moreover, we show similar trending on patterned Si substrates, albeit to a lesser extent than on comparably patterned Ti substrates. Collectively, these results suggest promise for sub-micrometer topographic patterning in general, and sub-micrometer patterning of Ti specifically, as a means for enhancing endothelialization and neovascularisation for novel implantable microdevice applications.

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Fabrication processes for the patterned Ti (left) and Si (right) substrates.Patterned Ti substrate fabrication: 1) SiO2 deposition by PECVD, followed by PR application; 2) Lithographic patterning via thermal NIL with patterned Si imprint master; 3) Pattern transfer to SiO2 by F-based dry etching; 4) PR removal and Ti DRIE etch; and 5) Final SiO2 removal by F-based dry etching. Patterned Si substrate fabrication: 1) PR application; 2) Lithographic exposure via projection lithography; 3) PR development and O2 plasma descum; and 4) F-based dry etching and PR removal.
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pone-0111465-g002: Fabrication processes for the patterned Ti (left) and Si (right) substrates.Patterned Ti substrate fabrication: 1) SiO2 deposition by PECVD, followed by PR application; 2) Lithographic patterning via thermal NIL with patterned Si imprint master; 3) Pattern transfer to SiO2 by F-based dry etching; 4) PR removal and Ti DRIE etch; and 5) Final SiO2 removal by F-based dry etching. Patterned Si substrate fabrication: 1) PR application; 2) Lithographic exposure via projection lithography; 3) PR development and O2 plasma descum; and 4) F-based dry etching and PR removal.

Mentions: Figure 2 outlines the fabrication processes for the patterned Ti and Si substrates. In both cases, polished substrates were first subjected to a standard solvent cleaning procedure consisting of sequential sonication in acetone and isopropanol, followed by rinsing in deionized (DI) water, and drying with N2 gas.


Comparative endothelial cell response on topographically patterned titanium and silicon substrates with micrometer to sub-micrometer feature sizes.

Vandrangi P, Gott SC, Kozaka R, Rodgers VG, Rao MP - PLoS ONE (2014)

Fabrication processes for the patterned Ti (left) and Si (right) substrates.Patterned Ti substrate fabrication: 1) SiO2 deposition by PECVD, followed by PR application; 2) Lithographic patterning via thermal NIL with patterned Si imprint master; 3) Pattern transfer to SiO2 by F-based dry etching; 4) PR removal and Ti DRIE etch; and 5) Final SiO2 removal by F-based dry etching. Patterned Si substrate fabrication: 1) PR application; 2) Lithographic exposure via projection lithography; 3) PR development and O2 plasma descum; and 4) F-based dry etching and PR removal.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC4214724&req=5

pone-0111465-g002: Fabrication processes for the patterned Ti (left) and Si (right) substrates.Patterned Ti substrate fabrication: 1) SiO2 deposition by PECVD, followed by PR application; 2) Lithographic patterning via thermal NIL with patterned Si imprint master; 3) Pattern transfer to SiO2 by F-based dry etching; 4) PR removal and Ti DRIE etch; and 5) Final SiO2 removal by F-based dry etching. Patterned Si substrate fabrication: 1) PR application; 2) Lithographic exposure via projection lithography; 3) PR development and O2 plasma descum; and 4) F-based dry etching and PR removal.
Mentions: Figure 2 outlines the fabrication processes for the patterned Ti and Si substrates. In both cases, polished substrates were first subjected to a standard solvent cleaning procedure consisting of sequential sonication in acetone and isopropanol, followed by rinsing in deionized (DI) water, and drying with N2 gas.

Bottom Line: These specific materials are chosen due to their relevance for implantable microdevice applications, while grating-based patterns are chosen for the potential they afford for inducing elongated and aligned cellular morphologies reminiscent of the native endothelium.Moreover, we show similar trending on patterned Si substrates, albeit to a lesser extent than on comparably patterned Ti substrates.Collectively, these results suggest promise for sub-micrometer topographic patterning in general, and sub-micrometer patterning of Ti specifically, as a means for enhancing endothelialization and neovascularisation for novel implantable microdevice applications.

View Article: PubMed Central - PubMed

Affiliation: Department of Mechanical Engineering, University of California Riverside, Riverside, California, United States of America; Department of Bioengineering, University of California Riverside, Riverside, California, United States of America.

ABSTRACT
In this work, we evaluate the in vitro response of endothelial cells (EC) to variation in precisely-defined, micrometer to sub-micrometer scale topography on two different substrate materials, titanium (Ti) and silicon (Si). Both substrates possess identically-patterned surfaces composed of microfabricated, groove-based gratings with groove widths ranging from 0.5 to 50 µm, grating pitch twice the groove width, and groove depth of 1.3 µm. These specific materials are chosen due to their relevance for implantable microdevice applications, while grating-based patterns are chosen for the potential they afford for inducing elongated and aligned cellular morphologies reminiscent of the native endothelium. Using EA926 cells, a human EC variant, we show significant improvement in cellular adhesion, proliferation, morphology, and function with decreasing feature size on patterned Ti substrates. Moreover, we show similar trending on patterned Si substrates, albeit to a lesser extent than on comparably patterned Ti substrates. Collectively, these results suggest promise for sub-micrometer topographic patterning in general, and sub-micrometer patterning of Ti specifically, as a means for enhancing endothelialization and neovascularisation for novel implantable microdevice applications.

Show MeSH
Related in: MedlinePlus