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Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

View Article: PubMed Central

ABSTRACT

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

No MeSH data available.


Examples of CMOS-integrated microsensors developed by our research group, (a) CMOS-integrated three-axis accelerometer [6], (b) Nerve potential sensor array [7].
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f2-sensors-07-01387: Examples of CMOS-integrated microsensors developed by our research group, (a) CMOS-integrated three-axis accelerometer [6], (b) Nerve potential sensor array [7].

Mentions: Figure 1 shows the diagram of the proposed concept of our intelligent human sensing system [3]. The system can collect data during the subject's daily routine, providing health information in real-time to medical researchers. To meet this objective this system should be a wearable, mobile, and fully integrated wireless sensor system. Wearable sensing systems and smart sensors that are integrated with the communication circuit have been reported. For example, the Wearable Computing Group's LiveNet [4] of MIT and the Smart Dust Project [5] of the University of California, Berkeley, are pioneering works in this field. However, device fabrication technology needed to achieve integration of various sensors and the RF transmitter, including complementary metal-oxide semiconductor (CMOS) processing circuits on silicon, has not been established at present. Figures 2(a) and (b) show a CMOS-integrated three axis accelerometer [6] and a smart nerve potential sensor array [7], respectively, that have been developed by our group. They will be the essential sensor elements for detection of human motion and nerve activity for the purpose of intelligent human sensing. The integration of the RF communication unit, including RF circuitry, and the on-chip antenna on such smart complementary metal oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) sensors is required. Thus, essential fabrication technologies of the RF communication unit for wireless smart micro sensors have been developed [8]. Nevertheless, the passive matching element that is inductor was not yet integrated. In this paper, the development of an integration technique for RF transmitters to include an integrated inductor that will be integrated on smart microsensors is presented.


Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems
Examples of CMOS-integrated microsensors developed by our research group, (a) CMOS-integrated three-axis accelerometer [6], (b) Nerve potential sensor array [7].
© Copyright Policy
Related In: Results  -  Collection

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getmorefigures.php?uid=PMC3814858&req=5

f2-sensors-07-01387: Examples of CMOS-integrated microsensors developed by our research group, (a) CMOS-integrated three-axis accelerometer [6], (b) Nerve potential sensor array [7].
Mentions: Figure 1 shows the diagram of the proposed concept of our intelligent human sensing system [3]. The system can collect data during the subject's daily routine, providing health information in real-time to medical researchers. To meet this objective this system should be a wearable, mobile, and fully integrated wireless sensor system. Wearable sensing systems and smart sensors that are integrated with the communication circuit have been reported. For example, the Wearable Computing Group's LiveNet [4] of MIT and the Smart Dust Project [5] of the University of California, Berkeley, are pioneering works in this field. However, device fabrication technology needed to achieve integration of various sensors and the RF transmitter, including complementary metal-oxide semiconductor (CMOS) processing circuits on silicon, has not been established at present. Figures 2(a) and (b) show a CMOS-integrated three axis accelerometer [6] and a smart nerve potential sensor array [7], respectively, that have been developed by our group. They will be the essential sensor elements for detection of human motion and nerve activity for the purpose of intelligent human sensing. The integration of the RF communication unit, including RF circuitry, and the on-chip antenna on such smart complementary metal oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) sensors is required. Thus, essential fabrication technologies of the RF communication unit for wireless smart micro sensors have been developed [8]. Nevertheless, the passive matching element that is inductor was not yet integrated. In this paper, the development of an integration technique for RF transmitters to include an integrated inductor that will be integrated on smart microsensors is presented.

View Article: PubMed Central

ABSTRACT

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

No MeSH data available.