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Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

View Article: PubMed Central

ABSTRACT

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

No MeSH data available.


The multi-chip packaged smart microsensor and the concept diagram of one chip.
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f15-sensors-07-01387: The multi-chip packaged smart microsensor and the concept diagram of one chip.

Mentions: The sensor chip consists of the RF transmitter chip and the bonding wire inductor chip for impedance matching and integrated antenna chip was fabricated on silicon, respectively. Following the fabricating, each chip was packaged on the printed circuit board (PCB). The transmission performance was measured after the impedance matching procedure using the wire bonding inductor. The received power really makes no difference between matching by the SMD inductor and the wire bonding inductor. Figure 15 presents the fabricated smart microsensor on the PCB and the concept of one chip for the further works. The integration techniques for fully integrated smart microsensor were successfully established. By these integration techniques, the wireless smart microsensor system that was fully integrated one chip shown in the Figure 15 will be realized in our next work.


Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems
The multi-chip packaged smart microsensor and the concept diagram of one chip.
© Copyright Policy
Related In: Results  -  Collection

Show All Figures
getmorefigures.php?uid=PMC3814858&req=5

f15-sensors-07-01387: The multi-chip packaged smart microsensor and the concept diagram of one chip.
Mentions: The sensor chip consists of the RF transmitter chip and the bonding wire inductor chip for impedance matching and integrated antenna chip was fabricated on silicon, respectively. Following the fabricating, each chip was packaged on the printed circuit board (PCB). The transmission performance was measured after the impedance matching procedure using the wire bonding inductor. The received power really makes no difference between matching by the SMD inductor and the wire bonding inductor. Figure 15 presents the fabricated smart microsensor on the PCB and the concept of one chip for the further works. The integration techniques for fully integrated smart microsensor were successfully established. By these integration techniques, the wireless smart microsensor system that was fully integrated one chip shown in the Figure 15 will be realized in our next work.

View Article: PubMed Central

ABSTRACT

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

No MeSH data available.