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Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

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ABSTRACT

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

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The measured Q and L of a bonding wire inductor
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f14-sensors-07-01387: The measured Q and L of a bonding wire inductor

Mentions: The bonding wire inductor results in Q of 1.65 at 162-MHz was measured. The resonant frequency is 345-MHz and L=31.3 nH at 300-MHz. The measured resonant frequency and inductance corresponded to the simulated results proportionally. However, the measured Q-factor did not correspond to the simulation. The Q-factor is dominated by the geometrics and process parameters of the inductor. Then, extraction of Q-factor from simulations is more complicated than the inductance. As a result, the Q-factor of bonding wire inductors was improved, then the Q-factor of spiral inductors and the bonding wire inductor was suitable for impedance matching. The measured results are shown in Figure 14. Therefore, the bonding wire inductors were fabricated and connected by wire bonding between the RF transmitter and the antenna.


Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems
The measured Q and L of a bonding wire inductor
© Copyright Policy
Related In: Results  -  Collection

Show All Figures
getmorefigures.php?uid=PMC3814858&req=5

f14-sensors-07-01387: The measured Q and L of a bonding wire inductor
Mentions: The bonding wire inductor results in Q of 1.65 at 162-MHz was measured. The resonant frequency is 345-MHz and L=31.3 nH at 300-MHz. The measured resonant frequency and inductance corresponded to the simulated results proportionally. However, the measured Q-factor did not correspond to the simulation. The Q-factor is dominated by the geometrics and process parameters of the inductor. Then, extraction of Q-factor from simulations is more complicated than the inductance. As a result, the Q-factor of bonding wire inductors was improved, then the Q-factor of spiral inductors and the bonding wire inductor was suitable for impedance matching. The measured results are shown in Figure 14. Therefore, the bonding wire inductors were fabricated and connected by wire bonding between the RF transmitter and the antenna.

View Article: PubMed Central

ABSTRACT

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

No MeSH data available.