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Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

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ABSTRACT

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

No MeSH data available.


The simulation model of bonding wire inductor for Ansoft HFSS.
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f11-sensors-07-01387: The simulation model of bonding wire inductor for Ansoft HFSS.

Mentions: In this paper, the bonding wire inductors for impedance matching that will be integrated on the wireless smart microsensors have been developed. Figure 11 shows the simulation model of bonding wire inductor for Ansoft HFSS. The bonding wire inductor usually had known high Q inductor on silicon substrate.


Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems
The simulation model of bonding wire inductor for Ansoft HFSS.
© Copyright Policy
Related In: Results  -  Collection

Show All Figures
getmorefigures.php?uid=PMC3814858&req=5

f11-sensors-07-01387: The simulation model of bonding wire inductor for Ansoft HFSS.
Mentions: In this paper, the bonding wire inductors for impedance matching that will be integrated on the wireless smart microsensors have been developed. Figure 11 shows the simulation model of bonding wire inductor for Ansoft HFSS. The bonding wire inductor usually had known high Q inductor on silicon substrate.

View Article: PubMed Central

ABSTRACT

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

No MeSH data available.