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Determination of Critical Conditions for the Formation of Electrodeposited Copper Structures Suitable for Electrodes in Electrochemical Devices

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ABSTRACT

Electrodeposition of copper from acid sulfate solutions at overpotentials on the plateau of the limiting diffusion current density and at higher overpotentials was examined. The average current efficiencies for hydrogen evolution reaction are determined by a measurement of the quantity of evolved hydrogen and the overall electrodeposition current as a function of electrodeposition time, while morphologies of copper deposits are examined by the use of the scanning electron microscopy (SEM) technique. It is found that the open and porous structures of copper deposits (denoted and as honeycomb – like copper structures), suitable for electrodes in electrochemical devices such as fuel cells and chemical sensors, were reached by electrodeposition processes from solutions with the lower concentrations of Cu (II) ions (0.15 M CuSO4 and less in 0.50 M H2SO4) at overpotentials outside the plateau of the limiting diffusion current density at which the quantity of evolved hydrogen was enough to change hydrodynamic conditions in the near – electrode layer. The main characteristics of these copper structures were craters or holes formed primarily due to the attachment hydrogen bubbles with agglomerates of copper grains between them.

No MeSH data available.


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The dependence of logarithm of the limiting diffusion current density, iL on logarithm of concentration of Cu (II) ions.
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f8-sensors-07-00001: The dependence of logarithm of the limiting diffusion current density, iL on logarithm of concentration of Cu (II) ions.

Mentions: Figure 8 shows the dependence of logarithm of the limiting diffusion current density, iL on the logarithm of the concentration of Cu(II) ions. From the obtained values of the slope and the intercept at the ordinate, it follows that the dependence of the limiting diffusion current density on the concentration of Cu(II) ions is given by iL = 0.32co1.18. On the basis of the slope value (1.18) it can be concluded that it is possible to apply Levich`s dependence of the limiting diffusion current density on the concentration of metal ions [12].


Determination of Critical Conditions for the Formation of Electrodeposited Copper Structures Suitable for Electrodes in Electrochemical Devices
The dependence of logarithm of the limiting diffusion current density, iL on logarithm of concentration of Cu (II) ions.
© Copyright Policy
Related In: Results  -  Collection

Show All Figures
getmorefigures.php?uid=PMC3756708&req=5

f8-sensors-07-00001: The dependence of logarithm of the limiting diffusion current density, iL on logarithm of concentration of Cu (II) ions.
Mentions: Figure 8 shows the dependence of logarithm of the limiting diffusion current density, iL on the logarithm of the concentration of Cu(II) ions. From the obtained values of the slope and the intercept at the ordinate, it follows that the dependence of the limiting diffusion current density on the concentration of Cu(II) ions is given by iL = 0.32co1.18. On the basis of the slope value (1.18) it can be concluded that it is possible to apply Levich`s dependence of the limiting diffusion current density on the concentration of metal ions [12].

View Article: PubMed Central

ABSTRACT

Electrodeposition of copper from acid sulfate solutions at overpotentials on the plateau of the limiting diffusion current density and at higher overpotentials was examined. The average current efficiencies for hydrogen evolution reaction are determined by a measurement of the quantity of evolved hydrogen and the overall electrodeposition current as a function of electrodeposition time, while morphologies of copper deposits are examined by the use of the scanning electron microscopy (SEM) technique. It is found that the open and porous structures of copper deposits (denoted and as honeycomb – like copper structures), suitable for electrodes in electrochemical devices such as fuel cells and chemical sensors, were reached by electrodeposition processes from solutions with the lower concentrations of Cu (II) ions (0.15 M CuSO4 and less in 0.50 M H2SO4) at overpotentials outside the plateau of the limiting diffusion current density at which the quantity of evolved hydrogen was enough to change hydrodynamic conditions in the near – electrode layer. The main characteristics of these copper structures were craters or holes formed primarily due to the attachment hydrogen bubbles with agglomerates of copper grains between them.

No MeSH data available.


Related in: MedlinePlus