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Numerical analysis of piezoelectric active repair in the presence of frictional contact conditions.

Alaimo A, Milazzo A, Orlando C, Messineo A - Sensors (Basel) (2013)

Bottom Line: In this paper, Boundary Element (BE) analyses performed on delaminated composite structures repaired by active piezoelectric patches are presented.A two-dimensional boundary integral formulation for piezoelectric solids based on the multi-domain technique to model the composite host damaged structures and the bonded piezoelectric patches is employed.The effect of the adhesive between the plies of piezoelectric bimorph devices on the electromechanical response is first pointed out for both sensing and actuating behavior.

View Article: PubMed Central - PubMed

Affiliation: Faculty of Engineering and Architecture, University of Enna Kore, Cittadella Universitaria 94100, Enna, Italy. andrea.alaimo@unikore.it

ABSTRACT
The increasing development of smart materials, such as piezoelectric and shape memory alloys, has opened new opportunities for improving repair techniques. Particularly, active repairs, based on the converse piezoelectric effect, can increase the life of a structure by reducing the crack opening. A deep characterization of the electromechanical behavior of delaminated composite structures, actively repaired by piezoelectric patches, can be achieved by considering the adhesive layer between the host structure and the repair and by taking into account the frictional contact between the crack surfaces. In this paper, Boundary Element (BE) analyses performed on delaminated composite structures repaired by active piezoelectric patches are presented. A two-dimensional boundary integral formulation for piezoelectric solids based on the multi-domain technique to model the composite host damaged structures and the bonded piezoelectric patches is employed. An interface spring model is also implemented to take into account the finite stiffness of the bonding layers and to model the frictional contact between the delamination surfaces, by means of an iterative procedure. The effect of the adhesive between the plies of piezoelectric bimorph devices on the electromechanical response is first pointed out for both sensing and actuating behavior. Then, the effect of the frictional contact condition on the fracture mechanics behavior of actively repaired delaminated composite structures is investigated.

No MeSH data available.


Related in: MedlinePlus

Through-the-thickness vertical displacement and longitudinal displacement.
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f9-sensors-13-04390: Through-the-thickness vertical displacement and longitudinal displacement.

Mentions: To point out the effect of the adhesive layer on the actuating performances of a piezoelectric bimorph with a series arrangement, in the second configuration analyzed, an electric potential is applied on the top and bottom faces of the device, VB = −50 V at x2 = 0 and VU = 50 V at x2 = h, as shown in Figure 6(b). Figure 9 shows the through-the-thickness normalized vertical and longitudinal displacement. The softening of the bimorph actuator, due to the adhesive layer, can be pointed out by observing a 17% reduction of the through-the-thickness deflection. Thus, the results show the need of modeling the bonding layer effects to accurately predict the actuating input voltage.


Numerical analysis of piezoelectric active repair in the presence of frictional contact conditions.

Alaimo A, Milazzo A, Orlando C, Messineo A - Sensors (Basel) (2013)

Through-the-thickness vertical displacement and longitudinal displacement.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3673090&req=5

f9-sensors-13-04390: Through-the-thickness vertical displacement and longitudinal displacement.
Mentions: To point out the effect of the adhesive layer on the actuating performances of a piezoelectric bimorph with a series arrangement, in the second configuration analyzed, an electric potential is applied on the top and bottom faces of the device, VB = −50 V at x2 = 0 and VU = 50 V at x2 = h, as shown in Figure 6(b). Figure 9 shows the through-the-thickness normalized vertical and longitudinal displacement. The softening of the bimorph actuator, due to the adhesive layer, can be pointed out by observing a 17% reduction of the through-the-thickness deflection. Thus, the results show the need of modeling the bonding layer effects to accurately predict the actuating input voltage.

Bottom Line: In this paper, Boundary Element (BE) analyses performed on delaminated composite structures repaired by active piezoelectric patches are presented.A two-dimensional boundary integral formulation for piezoelectric solids based on the multi-domain technique to model the composite host damaged structures and the bonded piezoelectric patches is employed.The effect of the adhesive between the plies of piezoelectric bimorph devices on the electromechanical response is first pointed out for both sensing and actuating behavior.

View Article: PubMed Central - PubMed

Affiliation: Faculty of Engineering and Architecture, University of Enna Kore, Cittadella Universitaria 94100, Enna, Italy. andrea.alaimo@unikore.it

ABSTRACT
The increasing development of smart materials, such as piezoelectric and shape memory alloys, has opened new opportunities for improving repair techniques. Particularly, active repairs, based on the converse piezoelectric effect, can increase the life of a structure by reducing the crack opening. A deep characterization of the electromechanical behavior of delaminated composite structures, actively repaired by piezoelectric patches, can be achieved by considering the adhesive layer between the host structure and the repair and by taking into account the frictional contact between the crack surfaces. In this paper, Boundary Element (BE) analyses performed on delaminated composite structures repaired by active piezoelectric patches are presented. A two-dimensional boundary integral formulation for piezoelectric solids based on the multi-domain technique to model the composite host damaged structures and the bonded piezoelectric patches is employed. An interface spring model is also implemented to take into account the finite stiffness of the bonding layers and to model the frictional contact between the delamination surfaces, by means of an iterative procedure. The effect of the adhesive between the plies of piezoelectric bimorph devices on the electromechanical response is first pointed out for both sensing and actuating behavior. Then, the effect of the frictional contact condition on the fracture mechanics behavior of actively repaired delaminated composite structures is investigated.

No MeSH data available.


Related in: MedlinePlus