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Power density of various light curing units through resin inlays with modified layer thickness.

Hong SO, Oh Y, Min JB, Kim JW, Lee BN, Hwang YC, Hwang IN, Oh WM, Chang HS - Restor Dent Endod (2012)

Bottom Line: The dentin layer, which had the dominant effect on power density reduction, was decreased in thickness from 0.5 to 0.1 mm while thickness of the enamel layer was kept unchanged at 0.5 mm and thickness of the translucent layer was increased from 0.5 to 0.9 mm and vice versa, in order to maintain the total thickness of 1.5 mm of the resin inlay.Power density measured through 0.5 mm resin wafers decreased more significantly with the dentin layer than with the enamel and translucent layers (p < 0.05).To enhance the power density through resin inlays, reducing the dentin layer thickness and increasing the translucent layer thickness would be recommendable when fabricating resin inlays.

View Article: PubMed Central - PubMed

Affiliation: Department of Conservative Dentistry, Wonkwang University College of Dentistry and Dental Research Institute, Iksan, Korea.

ABSTRACT

Objectives: The purpose of this study was to enhance curing light penetration through resin inlays by modifying the thicknesses of the dentin, enamel, and translucent layers.

Materials and methods: To investigate the layer dominantly affecting the power density of light curing units, resin wafers of each layer with 0.5 mm thickness were prepared and power density through resin wafers was measured with a dental radiometer (Cure Rite, Kerr). The dentin layer, which had the dominant effect on power density reduction, was decreased in thickness from 0.5 to 0.1 mm while thickness of the enamel layer was kept unchanged at 0.5 mm and thickness of the translucent layer was increased from 0.5 to 0.9 mm and vice versa, in order to maintain the total thickness of 1.5 mm of the resin inlay. Power density of various light curing units through resin inlays was measured.

Results: Power density measured through 0.5 mm resin wafers decreased more significantly with the dentin layer than with the enamel and translucent layers (p < 0.05). Power density through 1.5 mm resin inlays increased when the dentin layer thickness was reduced and the enamel or translucent layer thickness was increased. The highest power density was recorded with dentin layer thickness of 0.1 mm and increased translucent layer thickness in all light curing units.

Conclusions: To enhance the power density through resin inlays, reducing the dentin layer thickness and increasing the translucent layer thickness would be recommendable when fabricating resin inlays.

No MeSH data available.


Power densities of light curing units measured through 0.5 mm resin wafers. The power densities through the dentin, enamel, and translucent shades showed statistically significant differences (n = 7, p < 0.001). D2, dentin shade A2; E2, enamel shade E2; T1, translucent shade T1; 360, Optilux 360; FL2, Elipar FreeLight 2; S10, Elipar S10.
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Figure 2: Power densities of light curing units measured through 0.5 mm resin wafers. The power densities through the dentin, enamel, and translucent shades showed statistically significant differences (n = 7, p < 0.001). D2, dentin shade A2; E2, enamel shade E2; T1, translucent shade T1; 360, Optilux 360; FL2, Elipar FreeLight 2; S10, Elipar S10.

Mentions: Power densities through 0.5 mm resin wafers of each shade are shown in Figure 2. The two-way ANOVA showed a significant effect for both the main factors (shades, p < 0.001; LCUs, p < 0.001) and their interaction (p < 0.001). The power densities through the translucent, enamel, and dentin shades decreased significantly in that order.


Power density of various light curing units through resin inlays with modified layer thickness.

Hong SO, Oh Y, Min JB, Kim JW, Lee BN, Hwang YC, Hwang IN, Oh WM, Chang HS - Restor Dent Endod (2012)

Power densities of light curing units measured through 0.5 mm resin wafers. The power densities through the dentin, enamel, and translucent shades showed statistically significant differences (n = 7, p < 0.001). D2, dentin shade A2; E2, enamel shade E2; T1, translucent shade T1; 360, Optilux 360; FL2, Elipar FreeLight 2; S10, Elipar S10.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3569396&req=5

Figure 2: Power densities of light curing units measured through 0.5 mm resin wafers. The power densities through the dentin, enamel, and translucent shades showed statistically significant differences (n = 7, p < 0.001). D2, dentin shade A2; E2, enamel shade E2; T1, translucent shade T1; 360, Optilux 360; FL2, Elipar FreeLight 2; S10, Elipar S10.
Mentions: Power densities through 0.5 mm resin wafers of each shade are shown in Figure 2. The two-way ANOVA showed a significant effect for both the main factors (shades, p < 0.001; LCUs, p < 0.001) and their interaction (p < 0.001). The power densities through the translucent, enamel, and dentin shades decreased significantly in that order.

Bottom Line: The dentin layer, which had the dominant effect on power density reduction, was decreased in thickness from 0.5 to 0.1 mm while thickness of the enamel layer was kept unchanged at 0.5 mm and thickness of the translucent layer was increased from 0.5 to 0.9 mm and vice versa, in order to maintain the total thickness of 1.5 mm of the resin inlay.Power density measured through 0.5 mm resin wafers decreased more significantly with the dentin layer than with the enamel and translucent layers (p < 0.05).To enhance the power density through resin inlays, reducing the dentin layer thickness and increasing the translucent layer thickness would be recommendable when fabricating resin inlays.

View Article: PubMed Central - PubMed

Affiliation: Department of Conservative Dentistry, Wonkwang University College of Dentistry and Dental Research Institute, Iksan, Korea.

ABSTRACT

Objectives: The purpose of this study was to enhance curing light penetration through resin inlays by modifying the thicknesses of the dentin, enamel, and translucent layers.

Materials and methods: To investigate the layer dominantly affecting the power density of light curing units, resin wafers of each layer with 0.5 mm thickness were prepared and power density through resin wafers was measured with a dental radiometer (Cure Rite, Kerr). The dentin layer, which had the dominant effect on power density reduction, was decreased in thickness from 0.5 to 0.1 mm while thickness of the enamel layer was kept unchanged at 0.5 mm and thickness of the translucent layer was increased from 0.5 to 0.9 mm and vice versa, in order to maintain the total thickness of 1.5 mm of the resin inlay. Power density of various light curing units through resin inlays was measured.

Results: Power density measured through 0.5 mm resin wafers decreased more significantly with the dentin layer than with the enamel and translucent layers (p < 0.05). Power density through 1.5 mm resin inlays increased when the dentin layer thickness was reduced and the enamel or translucent layer thickness was increased. The highest power density was recorded with dentin layer thickness of 0.1 mm and increased translucent layer thickness in all light curing units.

Conclusions: To enhance the power density through resin inlays, reducing the dentin layer thickness and increasing the translucent layer thickness would be recommendable when fabricating resin inlays.

No MeSH data available.