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Power density of various light curing units through resin inlays with modified layer thickness.

Hong SO, Oh Y, Min JB, Kim JW, Lee BN, Hwang YC, Hwang IN, Oh WM, Chang HS - Restor Dent Endod (2012)

Bottom Line: The dentin layer, which had the dominant effect on power density reduction, was decreased in thickness from 0.5 to 0.1 mm while thickness of the enamel layer was kept unchanged at 0.5 mm and thickness of the translucent layer was increased from 0.5 to 0.9 mm and vice versa, in order to maintain the total thickness of 1.5 mm of the resin inlay.Power density measured through 0.5 mm resin wafers decreased more significantly with the dentin layer than with the enamel and translucent layers (p < 0.05).To enhance the power density through resin inlays, reducing the dentin layer thickness and increasing the translucent layer thickness would be recommendable when fabricating resin inlays.

View Article: PubMed Central - PubMed

Affiliation: Department of Conservative Dentistry, Wonkwang University College of Dentistry and Dental Research Institute, Iksan, Korea.

ABSTRACT

Objectives: The purpose of this study was to enhance curing light penetration through resin inlays by modifying the thicknesses of the dentin, enamel, and translucent layers.

Materials and methods: To investigate the layer dominantly affecting the power density of light curing units, resin wafers of each layer with 0.5 mm thickness were prepared and power density through resin wafers was measured with a dental radiometer (Cure Rite, Kerr). The dentin layer, which had the dominant effect on power density reduction, was decreased in thickness from 0.5 to 0.1 mm while thickness of the enamel layer was kept unchanged at 0.5 mm and thickness of the translucent layer was increased from 0.5 to 0.9 mm and vice versa, in order to maintain the total thickness of 1.5 mm of the resin inlay. Power density of various light curing units through resin inlays was measured.

Results: Power density measured through 0.5 mm resin wafers decreased more significantly with the dentin layer than with the enamel and translucent layers (p < 0.05). Power density through 1.5 mm resin inlays increased when the dentin layer thickness was reduced and the enamel or translucent layer thickness was increased. The highest power density was recorded with dentin layer thickness of 0.1 mm and increased translucent layer thickness in all light curing units.

Conclusions: To enhance the power density through resin inlays, reducing the dentin layer thickness and increasing the translucent layer thickness would be recommendable when fabricating resin inlays.

No MeSH data available.


Photograph of the custom-made aluminum mold with a movable Teflon plate attached to a bolt.
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Figure 1: Photograph of the custom-made aluminum mold with a movable Teflon plate attached to a bolt.

Mentions: A custom-made cylindrical aluminum mold 60 mm in diameter and 45 mm in length with a hole 15 mm in diameter and 30 mm in depth at the center was used to fabricate the resin wafers and resin inlays (Figure 1). A hole of 1.5 mm diameter was fabricated in order to ensure that the resin specimens could completely cover the power density measurement spot of dental radiometer, and also be larger than the fiberoptic tip diameter of the LCUs. A flat Teflon plate 15 mm in diameter was inserted into the hole and a bolt was attached to the opposite side of the plate, so that the space in the hole could be adjusted by the rotation of the bolt. By rotating the bolt 360 degrees counterclockwise, the Teflon plate could be moved in a downward direction thereby rendering a 1 mm deep empty space in the aluminum mold. The rotation of the bolt was marked in 10 steps such that one step corresponded to a downward movement of the Teflon plate by 0.1 mm.


Power density of various light curing units through resin inlays with modified layer thickness.

Hong SO, Oh Y, Min JB, Kim JW, Lee BN, Hwang YC, Hwang IN, Oh WM, Chang HS - Restor Dent Endod (2012)

Photograph of the custom-made aluminum mold with a movable Teflon plate attached to a bolt.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3569396&req=5

Figure 1: Photograph of the custom-made aluminum mold with a movable Teflon plate attached to a bolt.
Mentions: A custom-made cylindrical aluminum mold 60 mm in diameter and 45 mm in length with a hole 15 mm in diameter and 30 mm in depth at the center was used to fabricate the resin wafers and resin inlays (Figure 1). A hole of 1.5 mm diameter was fabricated in order to ensure that the resin specimens could completely cover the power density measurement spot of dental radiometer, and also be larger than the fiberoptic tip diameter of the LCUs. A flat Teflon plate 15 mm in diameter was inserted into the hole and a bolt was attached to the opposite side of the plate, so that the space in the hole could be adjusted by the rotation of the bolt. By rotating the bolt 360 degrees counterclockwise, the Teflon plate could be moved in a downward direction thereby rendering a 1 mm deep empty space in the aluminum mold. The rotation of the bolt was marked in 10 steps such that one step corresponded to a downward movement of the Teflon plate by 0.1 mm.

Bottom Line: The dentin layer, which had the dominant effect on power density reduction, was decreased in thickness from 0.5 to 0.1 mm while thickness of the enamel layer was kept unchanged at 0.5 mm and thickness of the translucent layer was increased from 0.5 to 0.9 mm and vice versa, in order to maintain the total thickness of 1.5 mm of the resin inlay.Power density measured through 0.5 mm resin wafers decreased more significantly with the dentin layer than with the enamel and translucent layers (p < 0.05).To enhance the power density through resin inlays, reducing the dentin layer thickness and increasing the translucent layer thickness would be recommendable when fabricating resin inlays.

View Article: PubMed Central - PubMed

Affiliation: Department of Conservative Dentistry, Wonkwang University College of Dentistry and Dental Research Institute, Iksan, Korea.

ABSTRACT

Objectives: The purpose of this study was to enhance curing light penetration through resin inlays by modifying the thicknesses of the dentin, enamel, and translucent layers.

Materials and methods: To investigate the layer dominantly affecting the power density of light curing units, resin wafers of each layer with 0.5 mm thickness were prepared and power density through resin wafers was measured with a dental radiometer (Cure Rite, Kerr). The dentin layer, which had the dominant effect on power density reduction, was decreased in thickness from 0.5 to 0.1 mm while thickness of the enamel layer was kept unchanged at 0.5 mm and thickness of the translucent layer was increased from 0.5 to 0.9 mm and vice versa, in order to maintain the total thickness of 1.5 mm of the resin inlay. Power density of various light curing units through resin inlays was measured.

Results: Power density measured through 0.5 mm resin wafers decreased more significantly with the dentin layer than with the enamel and translucent layers (p < 0.05). Power density through 1.5 mm resin inlays increased when the dentin layer thickness was reduced and the enamel or translucent layer thickness was increased. The highest power density was recorded with dentin layer thickness of 0.1 mm and increased translucent layer thickness in all light curing units.

Conclusions: To enhance the power density through resin inlays, reducing the dentin layer thickness and increasing the translucent layer thickness would be recommendable when fabricating resin inlays.

No MeSH data available.