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Measurements of true leak rates of MEMS packages.

Han B - Sensors (Basel) (2012)

Bottom Line: Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages.In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion).In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

View Article: PubMed Central - PubMed

Affiliation: CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA. bthan@umd.edu

ABSTRACT
Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

No MeSH data available.


Related in: MedlinePlus

Apparent leak rates and the corresponding regression fits of Package 1 with various dwell times: Case A = 5 min; Case B = 20 min. The reference case has a dwell time of 10 min (Figure 5(b)).
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f6-sensors-12-03082: Apparent leak rates and the corresponding regression fits of Package 1 with various dwell times: Case A = 5 min; Case B = 20 min. The reference case has a dwell time of 10 min (Figure 5(b)).

Mentions: The robustness of the technique was assessed by testing Package 1 again with different dwell times: 5 minutes (Case A) and 20 minutes (Case B). The apparent leak rate profile of each case and the corresponding regression fits are shown in Figure 6, where the reference case with a dwell time of 10 min is also shown for comparison.


Measurements of true leak rates of MEMS packages.

Han B - Sensors (Basel) (2012)

Apparent leak rates and the corresponding regression fits of Package 1 with various dwell times: Case A = 5 min; Case B = 20 min. The reference case has a dwell time of 10 min (Figure 5(b)).
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3376579&req=5

f6-sensors-12-03082: Apparent leak rates and the corresponding regression fits of Package 1 with various dwell times: Case A = 5 min; Case B = 20 min. The reference case has a dwell time of 10 min (Figure 5(b)).
Mentions: The robustness of the technique was assessed by testing Package 1 again with different dwell times: 5 minutes (Case A) and 20 minutes (Case B). The apparent leak rate profile of each case and the corresponding regression fits are shown in Figure 6, where the reference case with a dwell time of 10 min is also shown for comparison.

Bottom Line: Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages.In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion).In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

View Article: PubMed Central - PubMed

Affiliation: CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA. bthan@umd.edu

ABSTRACT
Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

No MeSH data available.


Related in: MedlinePlus