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Measurements of true leak rates of MEMS packages.

Han B - Sensors (Basel) (2012)

Bottom Line: Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages.In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion).In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

View Article: PubMed Central - PubMed

Affiliation: CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA. bthan@umd.edu

ABSTRACT
Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

No MeSH data available.


Effective chip surface deflections during the bombing and release stages; the encircled values correspond to the contour maps shown in Figure 12.
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f13-sensors-12-03082: Effective chip surface deflections during the bombing and release stages; the encircled values correspond to the contour maps shown in Figure 12.

Mentions: The effective deflections obtained from the 3-D maps are plotted in Figure 13, where the data points marked by a dotted circle were obtained from the results shown in Figure 12. Using the calibration curve (Equation (23)), the deflection values during the bombing and release stages were converted into pressure differential values. The internal cavity pressure was then calculated by subtracting these values from the known external pressure (4 atm while bombing and 0 atm during release) and is plotted in Figure 14.


Measurements of true leak rates of MEMS packages.

Han B - Sensors (Basel) (2012)

Effective chip surface deflections during the bombing and release stages; the encircled values correspond to the contour maps shown in Figure 12.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3376579&req=5

f13-sensors-12-03082: Effective chip surface deflections during the bombing and release stages; the encircled values correspond to the contour maps shown in Figure 12.
Mentions: The effective deflections obtained from the 3-D maps are plotted in Figure 13, where the data points marked by a dotted circle were obtained from the results shown in Figure 12. Using the calibration curve (Equation (23)), the deflection values during the bombing and release stages were converted into pressure differential values. The internal cavity pressure was then calculated by subtracting these values from the known external pressure (4 atm while bombing and 0 atm during release) and is plotted in Figure 14.

Bottom Line: Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages.In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion).In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

View Article: PubMed Central - PubMed

Affiliation: CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA. bthan@umd.edu

ABSTRACT
Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

No MeSH data available.