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Measurements of true leak rates of MEMS packages.

Han B - Sensors (Basel) (2012)

Bottom Line: Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages.In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion).In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

View Article: PubMed Central - PubMed

Affiliation: CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA. bthan@umd.edu

ABSTRACT
Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

No MeSH data available.


Schematic illustration of a MEMS package and the length of the leak channel, l.
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f1-sensors-12-03082: Schematic illustration of a MEMS package and the length of the leak channel, l.

Mentions: A schematic of a typical MEMS package of interest is shown in Figure 1. As illustrated in the figure, the package comprises of a cap and a substrate bonded to each other such that they enclose a cavity between them which houses the MEMS device. Cavity volumes are typically less than 10−3 cm3.


Measurements of true leak rates of MEMS packages.

Han B - Sensors (Basel) (2012)

Schematic illustration of a MEMS package and the length of the leak channel, l.
© Copyright Policy
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3376579&req=5

f1-sensors-12-03082: Schematic illustration of a MEMS package and the length of the leak channel, l.
Mentions: A schematic of a typical MEMS package of interest is shown in Figure 1. As illustrated in the figure, the package comprises of a cap and a substrate bonded to each other such that they enclose a cavity between them which houses the MEMS device. Cavity volumes are typically less than 10−3 cm3.

Bottom Line: Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages.In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion).In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

View Article: PubMed Central - PubMed

Affiliation: CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA. bthan@umd.edu

ABSTRACT
Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.

No MeSH data available.