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Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit.

Wang F, Li Y, Wang Y, Cao Z - Nanoscale Res Lett (2011)

Bottom Line: The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy.The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa.The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

View Article: PubMed Central - HTML - PubMed

Affiliation: College of Science, Northwest Agriculture and Forest University, Xi Nong Road No, 22, Yangling, Shaanxi 712100, China. wangfang4070@nwsuaf.edu.cn.

ABSTRACT
Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

No MeSH data available.


Related in: MedlinePlus

Surface images of epoxy resin. (a) The uncoated surface without ELD copper film, (b) ELD copper film on the uncoated surface, and (c) ELD copper film on the TESPA SAM uncoated surface.
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Figure 4: Surface images of epoxy resin. (a) The uncoated surface without ELD copper film, (b) ELD copper film on the uncoated surface, and (c) ELD copper film on the TESPA SAM uncoated surface.

Mentions: The surface image of TESPA SAM-coated epoxy resin substrate after ELD copper is shown in Figure 4. It can be seen that the surface is uniform and compact. The adhesion strength between TESPA SAM-coated epoxy resin and ELD copper film was up to 13.8 MPa, which could satisfy the purpose of TESPA SAM as adhesion enhancer and diffusion barrier layer, while the adhesion strength between non-TESPA-treated substrate and ELD copper film was only 1.2 MPa. It is clearly indicated that the TESPA SAM can be applied as interfacial adhesion enhancer and diffusion barrier. It is expected that TESPA will probably replace the traditional organosilane (MPTMS, APTMS, etc) to be applied in microelectronic industry. However, the interaction mechanism of two mercapto groups and nitrogen atoms in TESPA with copper remains to be studied. Also, the test [23] of leakage current density (jleakage) as a function of time during bias thermal annealing (BTA, tBTA) will be carried out. In order to understand the Cu-TESPA interface chemistry, XPS on Cu/TESPA/SiO2/Si structure will also be studied in the future research.


Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit.

Wang F, Li Y, Wang Y, Cao Z - Nanoscale Res Lett (2011)

Surface images of epoxy resin. (a) The uncoated surface without ELD copper film, (b) ELD copper film on the uncoated surface, and (c) ELD copper film on the TESPA SAM uncoated surface.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3211997&req=5

Figure 4: Surface images of epoxy resin. (a) The uncoated surface without ELD copper film, (b) ELD copper film on the uncoated surface, and (c) ELD copper film on the TESPA SAM uncoated surface.
Mentions: The surface image of TESPA SAM-coated epoxy resin substrate after ELD copper is shown in Figure 4. It can be seen that the surface is uniform and compact. The adhesion strength between TESPA SAM-coated epoxy resin and ELD copper film was up to 13.8 MPa, which could satisfy the purpose of TESPA SAM as adhesion enhancer and diffusion barrier layer, while the adhesion strength between non-TESPA-treated substrate and ELD copper film was only 1.2 MPa. It is clearly indicated that the TESPA SAM can be applied as interfacial adhesion enhancer and diffusion barrier. It is expected that TESPA will probably replace the traditional organosilane (MPTMS, APTMS, etc) to be applied in microelectronic industry. However, the interaction mechanism of two mercapto groups and nitrogen atoms in TESPA with copper remains to be studied. Also, the test [23] of leakage current density (jleakage) as a function of time during bias thermal annealing (BTA, tBTA) will be carried out. In order to understand the Cu-TESPA interface chemistry, XPS on Cu/TESPA/SiO2/Si structure will also be studied in the future research.

Bottom Line: The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy.The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa.The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

View Article: PubMed Central - HTML - PubMed

Affiliation: College of Science, Northwest Agriculture and Forest University, Xi Nong Road No, 22, Yangling, Shaanxi 712100, China. wangfang4070@nwsuaf.edu.cn.

ABSTRACT
Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

No MeSH data available.


Related in: MedlinePlus