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Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit.

Wang F, Li Y, Wang Y, Cao Z - Nanoscale Res Lett (2011)

Bottom Line: The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy.The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa.The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

View Article: PubMed Central - HTML - PubMed

Affiliation: College of Science, Northwest Agriculture and Forest University, Xi Nong Road No, 22, Yangling, Shaanxi 712100, China. wangfang4070@nwsuaf.edu.cn.

ABSTRACT
Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

No MeSH data available.


Related in: MedlinePlus

XPS survey spectra of TESPA SAM-coated epoxy resin surface. (a) Before Pd catalyzation and (b) after Pd catalyzation.
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Figure 3: XPS survey spectra of TESPA SAM-coated epoxy resin surface. (a) Before Pd catalyzation and (b) after Pd catalyzation.

Mentions: The results of XPS for the TESPA SAM before and after Pd catalyzation are shown in Figure 3. The presence of Sn3p, Sn3d, Pd3s, Pd3p, and Pd3d peaks suggests the adsorption of catalyst to TESPA SAM-coated surface, and the designed TESPA molecule covalently binds colloidal PdII catalysts, which can promote ELD copper film onto the TESPA SAM-coated surface [22].


Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit.

Wang F, Li Y, Wang Y, Cao Z - Nanoscale Res Lett (2011)

XPS survey spectra of TESPA SAM-coated epoxy resin surface. (a) Before Pd catalyzation and (b) after Pd catalyzation.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3211997&req=5

Figure 3: XPS survey spectra of TESPA SAM-coated epoxy resin surface. (a) Before Pd catalyzation and (b) after Pd catalyzation.
Mentions: The results of XPS for the TESPA SAM before and after Pd catalyzation are shown in Figure 3. The presence of Sn3p, Sn3d, Pd3s, Pd3p, and Pd3d peaks suggests the adsorption of catalyst to TESPA SAM-coated surface, and the designed TESPA molecule covalently binds colloidal PdII catalysts, which can promote ELD copper film onto the TESPA SAM-coated surface [22].

Bottom Line: The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy.The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa.The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

View Article: PubMed Central - HTML - PubMed

Affiliation: College of Science, Northwest Agriculture and Forest University, Xi Nong Road No, 22, Yangling, Shaanxi 712100, China. wangfang4070@nwsuaf.edu.cn.

ABSTRACT
Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

No MeSH data available.


Related in: MedlinePlus