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Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit.

Wang F, Li Y, Wang Y, Cao Z - Nanoscale Res Lett (2011)

Bottom Line: The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy.The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa.The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

View Article: PubMed Central - HTML - PubMed

Affiliation: College of Science, Northwest Agriculture and Forest University, Xi Nong Road No, 22, Yangling, Shaanxi 712100, China. wangfang4070@nwsuaf.edu.cn.

ABSTRACT
Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

No MeSH data available.


Related in: MedlinePlus

XPS survey spectra of epoxy resin surface: (a) uncoated and (b) TESPA SAM-coated. X-ray source is monochromated Al Kα ray. Testing area is 800 × 2,000 μm. Takeoff angle is 45°. The pressure in the preparation chamber is less than 10-7 Torr and less than 4 × 10-10 Torr in the analysis chamber.
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Figure 2: XPS survey spectra of epoxy resin surface: (a) uncoated and (b) TESPA SAM-coated. X-ray source is monochromated Al Kα ray. Testing area is 800 × 2,000 μm. Takeoff angle is 45°. The pressure in the preparation chamber is less than 10-7 Torr and less than 4 × 10-10 Torr in the analysis chamber.

Mentions: The XPS spectra of untreated and TESPA-treated epoxy resin substrate are shown in Figure 2. It can be seen that only the peaks of C1s, O1s, and N1s are observed for the untreated substrate, while the peaks of N1s, S2s, S2p, Si2s, and Si2p corresponding to the TESPA SAM-covered substrate. The results confirmed the formation of the TESPA SAM on the epoxy resin substrate. It can be concluded that the Si-OH groups of hydrolyzed TESPA (see Figure 1) react with the polar groups on the pre-treated epoxy resin surface to form the TESPA SAM. The thickness of the TESPA SAM was about 2.8 nm.


Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit.

Wang F, Li Y, Wang Y, Cao Z - Nanoscale Res Lett (2011)

XPS survey spectra of epoxy resin surface: (a) uncoated and (b) TESPA SAM-coated. X-ray source is monochromated Al Kα ray. Testing area is 800 × 2,000 μm. Takeoff angle is 45°. The pressure in the preparation chamber is less than 10-7 Torr and less than 4 × 10-10 Torr in the analysis chamber.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3211997&req=5

Figure 2: XPS survey spectra of epoxy resin surface: (a) uncoated and (b) TESPA SAM-coated. X-ray source is monochromated Al Kα ray. Testing area is 800 × 2,000 μm. Takeoff angle is 45°. The pressure in the preparation chamber is less than 10-7 Torr and less than 4 × 10-10 Torr in the analysis chamber.
Mentions: The XPS spectra of untreated and TESPA-treated epoxy resin substrate are shown in Figure 2. It can be seen that only the peaks of C1s, O1s, and N1s are observed for the untreated substrate, while the peaks of N1s, S2s, S2p, Si2s, and Si2p corresponding to the TESPA SAM-covered substrate. The results confirmed the formation of the TESPA SAM on the epoxy resin substrate. It can be concluded that the Si-OH groups of hydrolyzed TESPA (see Figure 1) react with the polar groups on the pre-treated epoxy resin surface to form the TESPA SAM. The thickness of the TESPA SAM was about 2.8 nm.

Bottom Line: The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy.The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa.The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

View Article: PubMed Central - HTML - PubMed

Affiliation: College of Science, Northwest Agriculture and Forest University, Xi Nong Road No, 22, Yangling, Shaanxi 712100, China. wangfang4070@nwsuaf.edu.cn.

ABSTRACT
Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

No MeSH data available.


Related in: MedlinePlus