Limits...
Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit.

Wang F, Li Y, Wang Y, Cao Z - Nanoscale Res Lett (2011)

Bottom Line: The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy.The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa.The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

View Article: PubMed Central - HTML - PubMed

Affiliation: College of Science, Northwest Agriculture and Forest University, Xi Nong Road No, 22, Yangling, Shaanxi 712100, China. wangfang4070@nwsuaf.edu.cn.

ABSTRACT
Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

No MeSH data available.


Related in: MedlinePlus

A strategy schema and designed molecule. (R = Cl; R' = NH2(CH2)3; R" = CH2CH3; Rx = NH (CH2)3).
© Copyright Policy - open-access
Related In: Results  -  Collection

License
getmorefigures.php?uid=PMC3211997&req=5

Figure 1: A strategy schema and designed molecule. (R = Cl; R' = NH2(CH2)3; R" = CH2CH3; Rx = NH (CH2)3).

Mentions: Our group has focused on the triazinedithiols (TDTs) [18-20] for many years. With two mercapto groups and aromatic ring with nitrogen atom, TDTs combine the advantages of SAM1 and SAM2, which have high reactivity with copper. Besides, nitrogen atom that existed between the two mercapto groups is different with SAM4, which possesses a better space position for copper immobilization. But the triazinedithiols could not react with the substrate for lack of silane group (Si-(OR)3). Therefore, our research concentrates on the combination of triazinedithiols and silane (see Figure 1).


Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit.

Wang F, Li Y, Wang Y, Cao Z - Nanoscale Res Lett (2011)

A strategy schema and designed molecule. (R = Cl; R' = NH2(CH2)3; R" = CH2CH3; Rx = NH (CH2)3).
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3211997&req=5

Figure 1: A strategy schema and designed molecule. (R = Cl; R' = NH2(CH2)3; R" = CH2CH3; Rx = NH (CH2)3).
Mentions: Our group has focused on the triazinedithiols (TDTs) [18-20] for many years. With two mercapto groups and aromatic ring with nitrogen atom, TDTs combine the advantages of SAM1 and SAM2, which have high reactivity with copper. Besides, nitrogen atom that existed between the two mercapto groups is different with SAM4, which possesses a better space position for copper immobilization. But the triazinedithiols could not react with the substrate for lack of silane group (Si-(OR)3). Therefore, our research concentrates on the combination of triazinedithiols and silane (see Figure 1).

Bottom Line: The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy.The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa.The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

View Article: PubMed Central - HTML - PubMed

Affiliation: College of Science, Northwest Agriculture and Forest University, Xi Nong Road No, 22, Yangling, Shaanxi 712100, China. wangfang4070@nwsuaf.edu.cn.

ABSTRACT
Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

No MeSH data available.


Related in: MedlinePlus