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Simultaneous fabrication of line defects-embedded periodic lattice by topographically assisted holographic lithography.

Choi BY, Pak Y, Kim KS, Lee KH, Jung GY - Nanoscale Res Lett (2011)

Bottom Line: For rapid fabrication of periodic structures incorporating nanoscale line-defects at large area, topographically assisted holographic lithography (TAHL) technique, combining the strength of hologram lithography and phase-shift interference, was proposed.Embossing temperature and relief height were crucial parameters for the successful TAHL process.Periodic holes with a diameter of 600 nm at a 1 μm-pitch incorporating 250 nm wide line-defects were obtained simultaneously.

View Article: PubMed Central - HTML - PubMed

Affiliation: Department of Materials Science and Engineering Gwangju Institute of Science and Technology (GIST), 261 Cheomdan-gwagiro, Buk-gu, Gwangju 500-712, Republic of Korea. gyjung@gist.ac.kr.

ABSTRACT
We have demonstrated simultaneous fabrication of designed defects within a periodic structure. For rapid fabrication of periodic structures incorporating nanoscale line-defects at large area, topographically assisted holographic lithography (TAHL) technique, combining the strength of hologram lithography and phase-shift interference, was proposed. Hot-embossing method generated the photoresist patterns with vertical side walls which enabled phase-shift mask effect at the edge of patterns. Embossing temperature and relief height were crucial parameters for the successful TAHL process. Periodic holes with a diameter of 600 nm at a 1 μm-pitch incorporating 250 nm wide line-defects were obtained simultaneously.

No MeSH data available.


The effect of temperature on TAHL process. Microscopic images and surface profiles of the embossed PR patterns at temperatures of (a) 70°C, (b) 90°C, and c) 110°C. FE-SEM cross-sectional views after single interference lithography and subsequent development with the embossed PR at temperatures of (d) 70°C, (e) 90°C and (f) 110°C.
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Figure 3: The effect of temperature on TAHL process. Microscopic images and surface profiles of the embossed PR patterns at temperatures of (a) 70°C, (b) 90°C, and c) 110°C. FE-SEM cross-sectional views after single interference lithography and subsequent development with the embossed PR at temperatures of (d) 70°C, (e) 90°C and (f) 110°C.

Mentions: However, hot-embossing revealed a drawback in the following holography process due to the possibility of PR degradation during the elevated heating. To minimize the polymer degradation, hot-embossing parameters needed to be initially optimized. Generally, polymers represent three types of thermo-rheological behaviours depending on temperature, e.g., glassy region below glass transition temperature (Tg), visco-elastic region above Tg and viscous region at a temperature sufficiently higher than Tg [20]. Since polymer materials can be thermally decomposed at the viscous region temperature, we carried out hot-embossing - changing from low to relatively high temperatures - to observe the temperature effect on the PR property. Hot-embossing with a PR (AZ nLoF 2020, Clariant, 1.4 μm thickness) was conducted at different temperatures of 70°C, 90°C and 110°C under a pressure of 4.7 bar; the results of each case were shown in Figure 3.


Simultaneous fabrication of line defects-embedded periodic lattice by topographically assisted holographic lithography.

Choi BY, Pak Y, Kim KS, Lee KH, Jung GY - Nanoscale Res Lett (2011)

The effect of temperature on TAHL process. Microscopic images and surface profiles of the embossed PR patterns at temperatures of (a) 70°C, (b) 90°C, and c) 110°C. FE-SEM cross-sectional views after single interference lithography and subsequent development with the embossed PR at temperatures of (d) 70°C, (e) 90°C and (f) 110°C.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3211868&req=5

Figure 3: The effect of temperature on TAHL process. Microscopic images and surface profiles of the embossed PR patterns at temperatures of (a) 70°C, (b) 90°C, and c) 110°C. FE-SEM cross-sectional views after single interference lithography and subsequent development with the embossed PR at temperatures of (d) 70°C, (e) 90°C and (f) 110°C.
Mentions: However, hot-embossing revealed a drawback in the following holography process due to the possibility of PR degradation during the elevated heating. To minimize the polymer degradation, hot-embossing parameters needed to be initially optimized. Generally, polymers represent three types of thermo-rheological behaviours depending on temperature, e.g., glassy region below glass transition temperature (Tg), visco-elastic region above Tg and viscous region at a temperature sufficiently higher than Tg [20]. Since polymer materials can be thermally decomposed at the viscous region temperature, we carried out hot-embossing - changing from low to relatively high temperatures - to observe the temperature effect on the PR property. Hot-embossing with a PR (AZ nLoF 2020, Clariant, 1.4 μm thickness) was conducted at different temperatures of 70°C, 90°C and 110°C under a pressure of 4.7 bar; the results of each case were shown in Figure 3.

Bottom Line: For rapid fabrication of periodic structures incorporating nanoscale line-defects at large area, topographically assisted holographic lithography (TAHL) technique, combining the strength of hologram lithography and phase-shift interference, was proposed.Embossing temperature and relief height were crucial parameters for the successful TAHL process.Periodic holes with a diameter of 600 nm at a 1 μm-pitch incorporating 250 nm wide line-defects were obtained simultaneously.

View Article: PubMed Central - HTML - PubMed

Affiliation: Department of Materials Science and Engineering Gwangju Institute of Science and Technology (GIST), 261 Cheomdan-gwagiro, Buk-gu, Gwangju 500-712, Republic of Korea. gyjung@gist.ac.kr.

ABSTRACT
We have demonstrated simultaneous fabrication of designed defects within a periodic structure. For rapid fabrication of periodic structures incorporating nanoscale line-defects at large area, topographically assisted holographic lithography (TAHL) technique, combining the strength of hologram lithography and phase-shift interference, was proposed. Hot-embossing method generated the photoresist patterns with vertical side walls which enabled phase-shift mask effect at the edge of patterns. Embossing temperature and relief height were crucial parameters for the successful TAHL process. Periodic holes with a diameter of 600 nm at a 1 μm-pitch incorporating 250 nm wide line-defects were obtained simultaneously.

No MeSH data available.