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Particle size effects in the thermal conductivity enhancement of copper-based nanofluids.

Saterlie M, Sahin H, Kavlicoglu B, Liu Y, Graeve O - Nanoscale Res Lett (2011)

Bottom Line: The copper nanoparticles were prepared using a chemical reduction methodology in the presence of a stabilizing surfactant, oleic acid or cetyl trimethylammonium bromide (CTAB).We found that the 0.55 vol.% Cu nanofluids exhibited excellent dispersion in the presence of SDBS.These results can be directly related to the particle/agglomerate size of the copper nanoparticles in water, as determined from dynamic light scattering.

View Article: PubMed Central - HTML - PubMed

Affiliation: Kazuo Inamori School of Engineering, Alfred University, 2 Pine Street, Alfred, NY 14802, USA. graeve@alfred.edu.

ABSTRACT
We present an analysis of the dispersion characteristics and thermal conductivity performance of copper-based nanofluids. The copper nanoparticles were prepared using a chemical reduction methodology in the presence of a stabilizing surfactant, oleic acid or cetyl trimethylammonium bromide (CTAB). Nanofluids were prepared using water as the base fluid with copper nanoparticle concentrations of 0.55 and 1.0 vol.%. A dispersing agent, sodium dodecylbenzene sulfonate (SDBS), and subsequent ultrasonication was used to ensure homogenous dispersion of the copper nanopowders in water. Particle size distribution of the copper nanoparticles in the base fluid was determined by dynamic light scattering. We found that the 0.55 vol.% Cu nanofluids exhibited excellent dispersion in the presence of SDBS. In addition, a dynamic thermal conductivity setup was developed and used to measure the thermal conductivity performance of the nanofluids. The 0.55 vol.% Cu nanofluids exhibited a thermal conductivity enhancement of approximately 22%. In the case of the nanofluids prepared from the powders synthesized in the presence of CTAB, the enhancement was approximately 48% over the base fluid for the 1.0 vol.% Cu nanofluids, which is higher than the enhancement values found in the literature. These results can be directly related to the particle/agglomerate size of the copper nanoparticles in water, as determined from dynamic light scattering.

No MeSH data available.


Experimental setup for thermal conductivity characterization of the nanofluids.
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Figure 1: Experimental setup for thermal conductivity characterization of the nanofluids.

Mentions: A commercially available liquid computer cooling system [32] was retrofitted with instrumentation in order to evaluate the thermal performance of the nanofluid, as shown in Figure 1(a). This cooling unit consists of a pump, radiator, cooler fan, refill reservoir, and cold plate. Validation and calibration of the instrument was completed by testing the thermal conductivity of de-ionized water and comparing the output with expected thermal conductivity data. In order to eliminate settling of the nanoparticles in the reservoir, a mixer, illustrated in Figure 1(b), was added to the experimental setup. Up to 200,000 cycles were continuously tested using our dynamic experimental setup. Experimental results show that the change in thermal conductivity of the nanofluid over the entire test (i.e., 200,000 cycles) is less than 1%, thus, our system is highly accurate.


Particle size effects in the thermal conductivity enhancement of copper-based nanofluids.

Saterlie M, Sahin H, Kavlicoglu B, Liu Y, Graeve O - Nanoscale Res Lett (2011)

Experimental setup for thermal conductivity characterization of the nanofluids.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3211274&req=5

Figure 1: Experimental setup for thermal conductivity characterization of the nanofluids.
Mentions: A commercially available liquid computer cooling system [32] was retrofitted with instrumentation in order to evaluate the thermal performance of the nanofluid, as shown in Figure 1(a). This cooling unit consists of a pump, radiator, cooler fan, refill reservoir, and cold plate. Validation and calibration of the instrument was completed by testing the thermal conductivity of de-ionized water and comparing the output with expected thermal conductivity data. In order to eliminate settling of the nanoparticles in the reservoir, a mixer, illustrated in Figure 1(b), was added to the experimental setup. Up to 200,000 cycles were continuously tested using our dynamic experimental setup. Experimental results show that the change in thermal conductivity of the nanofluid over the entire test (i.e., 200,000 cycles) is less than 1%, thus, our system is highly accurate.

Bottom Line: The copper nanoparticles were prepared using a chemical reduction methodology in the presence of a stabilizing surfactant, oleic acid or cetyl trimethylammonium bromide (CTAB).We found that the 0.55 vol.% Cu nanofluids exhibited excellent dispersion in the presence of SDBS.These results can be directly related to the particle/agglomerate size of the copper nanoparticles in water, as determined from dynamic light scattering.

View Article: PubMed Central - HTML - PubMed

Affiliation: Kazuo Inamori School of Engineering, Alfred University, 2 Pine Street, Alfred, NY 14802, USA. graeve@alfred.edu.

ABSTRACT
We present an analysis of the dispersion characteristics and thermal conductivity performance of copper-based nanofluids. The copper nanoparticles were prepared using a chemical reduction methodology in the presence of a stabilizing surfactant, oleic acid or cetyl trimethylammonium bromide (CTAB). Nanofluids were prepared using water as the base fluid with copper nanoparticle concentrations of 0.55 and 1.0 vol.%. A dispersing agent, sodium dodecylbenzene sulfonate (SDBS), and subsequent ultrasonication was used to ensure homogenous dispersion of the copper nanopowders in water. Particle size distribution of the copper nanoparticles in the base fluid was determined by dynamic light scattering. We found that the 0.55 vol.% Cu nanofluids exhibited excellent dispersion in the presence of SDBS. In addition, a dynamic thermal conductivity setup was developed and used to measure the thermal conductivity performance of the nanofluids. The 0.55 vol.% Cu nanofluids exhibited a thermal conductivity enhancement of approximately 22%. In the case of the nanofluids prepared from the powders synthesized in the presence of CTAB, the enhancement was approximately 48% over the base fluid for the 1.0 vol.% Cu nanofluids, which is higher than the enhancement values found in the literature. These results can be directly related to the particle/agglomerate size of the copper nanoparticles in water, as determined from dynamic light scattering.

No MeSH data available.