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Rapid thermal annealing and crystallization mechanisms study of silicon nanocrystal in silicon carbide matrix.

Wan Z, Huang S, Green MA, Conibeer G - Nanoscale Res Lett (2011)

Bottom Line: In this paper, a positive effect of rapid thermal annealing (RTA) technique has been researched and compared with conventional furnace annealing for Si nanocrystalline in silicon carbide (SiC) matrix system.Much better "degree of crystallization" of Si-NC can be achieved in RTA than furnace annealing from the research of GIXRD and Raman analysis, especially in high-Si-concentration situation.Differences from the two annealing procedures and the crystallization mechanism have been discussed based on the experimental results.

View Article: PubMed Central - HTML - PubMed

Affiliation: ARC Photovoltaics Centre of Excellence, University of New South Wales (UNSW), Sydney, Australia. z.wan@student.unsw.edu.au.

ABSTRACT
In this paper, a positive effect of rapid thermal annealing (RTA) technique has been researched and compared with conventional furnace annealing for Si nanocrystalline in silicon carbide (SiC) matrix system. Amorphous Si-rich SiC layer has been deposited by co-sputtering in different Si concentrations (50 to approximately 80 v%). Si nanocrystals (Si-NC) containing different grain sizes have been fabricated within the SiC matrix under two different annealing conditions: furnace annealing and RTA both at 1,100°C. HRTEM image clearly reveals both Si and SiC-NC formed in the films. Much better "degree of crystallization" of Si-NC can be achieved in RTA than furnace annealing from the research of GIXRD and Raman analysis, especially in high-Si-concentration situation. Differences from the two annealing procedures and the crystallization mechanism have been discussed based on the experimental results.

No MeSH data available.


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Si peak intensity of different Si concentration by RTA and furnace annealing.
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Figure 8: Si peak intensity of different Si concentration by RTA and furnace annealing.

Mentions: We then further measure the intensity of Si peak from XRD result carefully as shown in Figure 8. Under low Si concentration range (50 and 60 v%), Si peak intensity of samples annealed by either RTA or furnace are almost the same. The intensity of RTA samples increased dramatically to two to three times higher compared to the furnace annealing samples when Si concentration increased above 60 v%.


Rapid thermal annealing and crystallization mechanisms study of silicon nanocrystal in silicon carbide matrix.

Wan Z, Huang S, Green MA, Conibeer G - Nanoscale Res Lett (2011)

Si peak intensity of different Si concentration by RTA and furnace annealing.
© Copyright Policy - open-access
Related In: Results  -  Collection

License
Show All Figures
getmorefigures.php?uid=PMC3211175&req=5

Figure 8: Si peak intensity of different Si concentration by RTA and furnace annealing.
Mentions: We then further measure the intensity of Si peak from XRD result carefully as shown in Figure 8. Under low Si concentration range (50 and 60 v%), Si peak intensity of samples annealed by either RTA or furnace are almost the same. The intensity of RTA samples increased dramatically to two to three times higher compared to the furnace annealing samples when Si concentration increased above 60 v%.

Bottom Line: In this paper, a positive effect of rapid thermal annealing (RTA) technique has been researched and compared with conventional furnace annealing for Si nanocrystalline in silicon carbide (SiC) matrix system.Much better "degree of crystallization" of Si-NC can be achieved in RTA than furnace annealing from the research of GIXRD and Raman analysis, especially in high-Si-concentration situation.Differences from the two annealing procedures and the crystallization mechanism have been discussed based on the experimental results.

View Article: PubMed Central - HTML - PubMed

Affiliation: ARC Photovoltaics Centre of Excellence, University of New South Wales (UNSW), Sydney, Australia. z.wan@student.unsw.edu.au.

ABSTRACT
In this paper, a positive effect of rapid thermal annealing (RTA) technique has been researched and compared with conventional furnace annealing for Si nanocrystalline in silicon carbide (SiC) matrix system. Amorphous Si-rich SiC layer has been deposited by co-sputtering in different Si concentrations (50 to approximately 80 v%). Si nanocrystals (Si-NC) containing different grain sizes have been fabricated within the SiC matrix under two different annealing conditions: furnace annealing and RTA both at 1,100°C. HRTEM image clearly reveals both Si and SiC-NC formed in the films. Much better "degree of crystallization" of Si-NC can be achieved in RTA than furnace annealing from the research of GIXRD and Raman analysis, especially in high-Si-concentration situation. Differences from the two annealing procedures and the crystallization mechanism have been discussed based on the experimental results.

No MeSH data available.


Related in: MedlinePlus